# US 11,908,612 B2 · Coil component

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- Number: US 11,908,612 B2
- Document ID: US11908612B2
- Status: Granted
- Kind: B2
- Application number: 17/952,508
- Filed: 2022-09-26
- Published: 2023-01-26
- Granted: 2024-02-20
- Earliest claimed: 2018-12-17
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Dong Seob Lee; Jong Min Lee
- Web page: https://patentgrep.com/patent/US11908612B2

## CPC

- H01F 27/292: {Surface mounted devices}
- H01F 3/08: made from powder (powder coatings on sheets H01F3/02; on strips or ribbons H01F3/04; on wires H01F3/06)
- H01F 17/0013: {with stacked layers}
- H01F 17/04: with magnetic core
- H01F 27/022: {Encapsulation}
- H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support}
- H01F 27/324: {Insulation between coil and core, between different winding sections, around the coil; Other insulation structures}
- H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder}
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 μm<T2<120 μm.

## Claims

### Claim 1

A coil component comprising:
an insulating substrate;
a first coil pattern, having a planar spiral shape, disposed on one surface of the insulating substrate;
a second coil pattern, having a planar spiral shape, disposed on the other surface of the insulating substrate opposing the one surface of the insulating substrate; and
a body embedding the insulating substrate and the first and second coil patterns, and having an active portion in which the first and second coil patterns are disposed, an upper cover portion disposed on an upper surface of the active portion and a lower cover portion disposed on a lower surface of the active portion,
wherein a thickness of the body is 550 μm or less (excluding 0), and
a total thickness of the upper and lower cover portions is thicker than four times of a thickness of the insulating substrate and thinner than a total thickness of the first and second coil patterns.

### Claim 2 (depends on 1)

The coil component according to claim 1, wherein the thickness (T1) of the insulating substrate satisfies 20 μm<T1≤30 μm.

### Claim 3 (depends on 1)

The coil component according to claim 1, further comprising a via passing through the insulating substrate to connect the first coil pattern and the second coil pattern to each other.

### Claim 4 (depends on 1)

The coil component according to claim 1, wherein the body comprises an insulating resin and a magnetic powder particle.

### Claim 5 (depends on 1)

The coil component according to claim 1, further comprising first and second external electrodes disposed on a surface of the body to be respectively connected to both end portions of the first and second coil patterns.

### Claim 6 (depends on 5)

The coil component according to claim 5, wherein a thickness of the coil component is 600 μm or less (excluding 0).

### Claim 7 (depends on 1)

The coil component according to claim 1, further comprising an insulating film disposed to cover and be in contact with the first and second coil patterns.

### Claim 8 (depends on 7)

The coil component according to claim 7, wherein the insulating substrate comprises a through-hole providing an inner surface of the insulating substrate, and
the insulating film further covers the inner side surface and an outer side surface of the insulating substrate.

### Claim 9 (depends on 1)

The coil component according to claim 1, wherein a ratio of a thickness (T2) of the upper cover portion to the thickness (T1) of the insulating substrate satisfies 3<T2/T1<6.

### Claim 10 (depends on 1)

The coil component according to claim 1, wherein a thickness (T2) of the upper cover portion satisfies 90 μm<T2<120 μm.