# US 11,907,790 B2 · Component identification > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,907,790 B2 - Document ID: US11907790B2 - Status: Granted - Kind: B2 - Application number: 17/028,073 - Filed: 2020-09-22 - Published: 2021-09-09 - Granted: 2024-02-20 - Earliest claimed: 2020-03-06 - Assignees: Hutchinson Technology Incorporated - Applicants: Hutchinson Technology Incorporated - Inventors: Dean E. Myers; Michael W. Davis; Clark T. Olsen; Beauregard J. Gagnon - Web page: https://patentgrep.com/patent/US11907790B2 ## CPC - G06K 19/0672: {with resonating marks} - G06K 19/07766: {comprising at least a second communication arrangement in addition to a first non-contact communication arrangement} - G06K 19/0723: {the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs} - G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)} - G06K 19/07781: {the coil being fabricated in a winding process} - G06K 19/07783: {the coil being planar} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS ## Abstract An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer. ## Claims ### Claim 1 An identification device comprising: a first metal layer patterned into a planar coil winding configured to have an inductance; a second metal layer electrically connected to the first metal layer, the second metal layer includes an outer layer and a central overlapping area connected to the outer layer that overlaps with the first metal layer and configured to have a capacitance, wherein an aperture is formed between the central overlapping area and the outer layer; and a dielectric layer separating the first metal layer and the second metal layer. ### Claim 2 (depends on 1) The identification device of claim 1, wherein the outer layer of the second metal layer is electrically connected to the first metal layer with one or more vias. ### Claim 3 (depends on 2) The identification device of claim 2, wherein the capacitance of the second metal layer is adjustable by adjusting the one or more overlapping areas and a presence and a location of the one or more vias that electrically connect the first and second metal layers. ### Claim 4 (depends on 1) The identification device of claim 1, wherein the one or more overlapping areas of the second metal layer overlap a first portion of the first metal layer. ### Claim 5 (depends on 1) The identification device of claim 1, wherein the identification device is a v configured to absorb power that is maximized at a resonance frequency (fres) of the laminate structure when inductively coupled to an AC magnetic field. ### Claim 6 (depends on 5) The identification device of claim 5, wherein the resonant frequency of the laminate structure is set to a specific target frequency and/or frequency spectrum to uniquely identify an attached component. ### Claim 7 (depends on 6) The identification device of claim 6, wherein the resonant frequency of the laminate structure is characterized with a frequency sweep of a measured impedance, the measured impedance is either reflected by or transmitted to an inductively coupled detector coil placed near the laminate structure. ### Claim 8 (depends on 1) The identification device of claim 1, wherein the inductance of the first metal layer is configured by adjusting at least one of a coil diameter, number of coil turns and width of a coil trace. ### Claim 9 (depends on 8) The identification device of claim 8, wherein a resonance frequency full width half maximum (FWHM), sharpness, and quality factor of the first metal layer is configured by adjusting a height of the coil trace. ### Claim 10 (depends on 1) The identification device of claim 1, wherein the second metal layer includes more than one segmented areas. ### Claim 11 (depends on 10) The identification device of claim 10, wherein the more than one segmented areas are meandered. ### Claim 12 (depends on 1) The identification device of claim 1, wherein the capacitance of the second metal layer is configured by adjusting at least one of a thickness of the dielectric layer, and a composition of the dielectric layer. ### Claim 13 (depends on 1) The identification device of claim 1, wherein the dielectric layer is made of polyimide and has a thickness between 0.007-0.015 mm thickness. ### Claim 14 (depends on 1) The identification device of claim 1, wherein the first metal layer is made of copper and has a thickness between 0.005-0.018 mm thickness. ### Claim 15 (depends on 1) The identification device of claim 1, wherein the second metal layer includes Stainless Steel or Copper Alloy and has a thickness between 0.018-0.055 mm thickness. ### Claim 16 A component comprising: an identification device including: a first metal layer patterned into a planar coil winding configured to have an inductance; a second metal layer electrically connected to the first metal layer, the second metal layer is patterned to provide an outer layer and a central overlapping area that connects to the outer layer and overlaps with the first metal layer and is configured to have a capacitance, wherein an aperture is formed between the central overlapping area and the outer layer; and a dielectric layer separating the first metal layer and the second metal layer. ### Claim 17 (depends on 16) The component of claim 16, wherein the outer layer of the second metal layer is electrically connected to the first metal layer with one or more vias. ### Claim 18 (depends on 17) The component of claim 17, wherein the capacitance of the second metal layer is configured by adjusting the one or more overlapping areas and a presence and a location of the one or more vias that electrically connect the first and second metal layers. ### Claim 19 (depends on 16) The component of claim 16, wherein the one or more overlapping areas of the second metal layer overlap a first portion of the first metal layer. ### Claim 20 (depends on 16) The component of claim 16, wherein the dielectric layer is made of polyimide and has a thickness between 0.007-0.015 mm thickness. ### Claim 21 (depends on 16) The component of claim 16, wherein the first metal layer is made of copper and has a thickness between 0.005-0.018 mm thickness.