# US 11,907,787 B2 · Dual interface metallic transaction cards and methods of manufacturing the same

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- Number: US 11,907,787 B2
- Document ID: US11907787B2
- Status: Granted
- Kind: B2
- Application number: 17/660,248
- Filed: 2022-04-22
- Published: 2023-09-07
- Granted: 2024-02-20
- Earliest claimed: 2022-03-01
- Assignees: Anomatic Corporation
- Applicants: Anomatic Corporation
- Inventors: Mark A. Ormiston
- Web page: https://patentgrep.com/patent/US11907787B2

## CPC

- G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)}
- G06K 19/02: characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K 19/044: {comprising galvanic contacts for contacting an integrated circuit chip thereon}
- G06K 19/045: {the record carrier being of the non-contact type, e.g. RFID, and being specially adapted for attachment to a disc, e.g. a CD or DVD}
- G06K 19/07754: {the connection being galvanic}
- G06K 19/07769: {the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface}
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS

## Abstract

A dual interface transaction card for contact and contactless transactions including an anodized top metal layer. The arrangement of layers allowing for high conductivity metals such as aluminum to be used without compromising the contactless function of the card.

## Claims

### Claim 1

A transaction card configured for contactless and contact transactions, comprising:
a top metal layer having an upper surface and a bottom surface;
a magnetic platform comprising:
a magnetic layer having an upper surface, a bottom surface, and a periphery extending between the bottom surface and the upper surface of the magnetic layer,
a thermoplastic perimeter layer surrounding the periphery of the magnetic layer,
a first adhesive layer adhering the upper surface of the magnetic layer to the bottom surface of the top metal layer, and
a second adhesive layer adhering to the bottom surface of the magnetic layer;
an antenna package layer adhering to the second adhesive layer; and
a thermoplastic layer having an upper side and a lower side, the upper side of the thermoplastic layer adhering to a side of the antenna package opposite the second adhesive layer.

### Claim 2 (depends on 1)

The transaction card according to claim 1, wherein the antenna package layer includes an antenna layer sandwiched between two thermoplastic overlay layers.

### Claim 3 (depends on 1)

The transaction card according to claim 1, wherein the metal layer has a conductivity greater than 10 million Siemens/meter.

### Claim 4 (depends on 1)

The transaction card according to claim 1, wherein the metal layer is aluminum.

### Claim 5 (depends on 1)

The transaction card according to claim 1, wherein metal layer has a yield strength between 40 and 60 ksi.

### Claim 6 (depends on 1)

The transaction card according to claim 1, further comprising a chip module in electronic communication with the antenna layer and configured to receive an activating radio frequency energy.

### Claim 7 (depends on 1)

The transaction card according to claim 1, further comprising a bottom overlay layer disposed on the lower side of the thermoplastic layer, wherein the bottom overlay layer comprises a magnetic stripe.

### Claim 8 (depends on 1)

The transaction card according to claim 1, further comprising a bottom overlay layer disposed on the lower side of the thermoplastic layer, wherein the bottom overlay layer is transparent.

### Claim 9 (depends on 8)

The transaction card according to claim 8, wherein thermoplastic layer comprises a graphic that is visible through the bottom overlay layer.

### Claim 10 (depends on 1)

The transaction card according to claim 1, further comprising a bottom overlay layer disposed on the lower side of the thermoplastic layer, wherein the bottom overlay layer is thinner than the thermoplastic layer.