# US 11,906,879 B2 · Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,879 B2 - Document ID: US11906879B2 - Status: Granted - Kind: B2 - Application number: 17/603,183 - Filed: 2020-03-02 - Published: 2022-06-09 - Granted: 2024-02-20 - Earliest claimed: 2019-04-12 - Assignees: Ningbo Sunny Opotech Co., Ltd. - Applicants: Ningbo Sunny Opotech Co., Ltd. - Inventors: Zhen Huang; Zhongyu Luan; Zongchun Yang; Fengsheng Xi; Chenxiang Xu - Web page: https://patentgrep.com/patent/US11906879B2 ## CPC - G03B 17/02: Bodies - B29D 11/00807: {Producing lenses combined with electronics, e.g. chips} - G03B 13/34: Power focusing - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly. The second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by a second outer side surface of the second molded portion and the first upper surface of the first molded portion. ## Claims ### Claim 1 A molded photosensitive assembly, characterized in that the molded photosensitive assembly comprises: an imaging assembly; a molded base, wherein the molded base includes: a first molded portion, wherein the first molded portion embeds a part of the imaging assembly, and the first molded portion has a first upper surface; and a second molded portion, wherein the second molded portion is integrally formed on the first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface; and a filter member, wherein the filter member is correspondingly disposed on the second upper surface of the second molded portion; wherein the second upper surface of the second molded portion is higher than the first upper surface of the first molded portion, so as to define and form an outer space by the second outer side surface of the second molded portion and the first upper surface of the first molded portion. ### Claim 2 (depends on 1) The molded photosensitive assembly according to claim 1, wherein the second upper surface of the second molded portion is a flat surface. ### Claim 3 (depends on 1) The molded photosensitive assembly according to claim 1, wherein the molded base further includes a third molded portion, and the third molded portion integrally extends upward from the first upper surface of the first molded portion, and the third molded portion is located at outer side of the second molded portion, and the third molded portion is spaced apart from the second molded portion. ### Claim 4 (depends on 3) The molded photosensitive assembly according to claim 3, wherein a distance between a third inner side surface of the third molded portion and the second outer side surface of the second molded portion is not less than 0.01 mm. ### Claim 5 (depends on 3) The molded photosensitive assembly according to claim 3, wherein the imaging assembly includes a circuit board, a photosensitive element conductively attached to the circuit board, and a group of electronic components conductively connected to the circuit board, and the third molded portion corresponds to the electronic components, and a third upper surface of the third molded portion is higher than top surfaces of the electronic components. ### Claim 6 (depends on 5) The molded photosensitive assembly according to claim 5, wherein the first upper surface of the first molded portion of the molded base is lower than the top surfaces of the electronic components. ### Claim 7 (depends on 5) The molded photosensitive assembly according to claim 5, wherein the third outer side surface of the third molded portion of the molded base is located at inner side of the first outer side surface of the first molded portion, so that a part of the first upper surface of the first molded portion outside the third molded portion is used for mounting at least one optical lenses. ### Claim 8 (depends on 7) The molded photosensitive assembly according to claim 7, wherein the molded base further includes a fourth molded portion, and the fourth molded portion is recessed downward from the first upper surface of the first molded portion, so as to form a peripheral groove on an outer periphery of the first molded portion; and a fourth upper surface of the fourth molded portion is used to provide a mounting surface for mounting the optical lenses. ### Claim 9 (depends on 7) The molded photosensitive assembly according to claim 7, wherein the molded base further includes a fourth molded portion, and the fourth molded portion extends upward from the first upper surface of the first molded portion, so as to form a peripheral protrusion on an outer periphery of the first molded portion; and a fourth upper surface of the fourth molded portion is used to provide a mounting surface for mounting the optical lenses. ### Claim 10 (depends on 5) The molded photosensitive assembly according to claim 5, wherein the third upper surface of the third molded portion of the molded base is higher than the second upper surface of the second molded portion. ### Claim 11 (depends on 10) The molded photosensitive assembly according to claim 10, wherein the third upper surface of the third molded portion is higher than an upper surface of the filter member, and the third upper surface of the third molded portion is adapted for corresponding to at least one optical lenses. ### Claim 12 (depends on 5) The molded photosensitive assembly according to claim 5, wherein the third molded portion is designed according to the size and position of the electronic components. ### Claim 13 (depends on 1) The molded photosensitive assembly according to claim 1, wherein a height difference between the second upper surface of the second molded portion and the first upper surface of the first molded portion is 0.03-0.2 mm. ### Claim 14 (depends on 1) The molded photosensitive assembly according to claim 1, further including an adhesive layer, wherein the adhesive layer is formed by curing an adhesive, and the adhesive layer is located between a lower surface of the filter member and the second upper surface of the second molded portion, so as to attach the filter member to the second upper surface of the second molded portion. ### Claim 15 (depends on 14) The molded photosensitive assembly according to claim 14, wherein a second inner side surface of the second molded portion is located at outer side of a first inner side surface of the first molded portion, so as to form an inner space inside the second molded portion. ### Claim 16 (depends on 1) The molded photosensitive assembly according to claim 1, wherein the second molded portion of the molded base is provided with at least one notch, so as to form an air escape hole at the notch of the second molded portion when the filter member is attached to the second upper surface of the second molded portion, so that an internal space of the molded photosensitive assembly is communicated to the outside of the molded photosensitive assembly through the air escape hole. ### Claim 17 (depends on 16) The molded photosensitive assembly according to claim 16, wherein the notch of the second molded portion extends laterally from the second inner side surface of the second molded portion to the second outer side surface of the second molded portion, so as to form the air escape hole arranged laterally. ### Claim 18 (depends on 17) The molded photosensitive assembly according to claim 17, wherein the molded base further includes a molded reinforcement portion, and wherein the molded reinforcement portion is formed at the notch of the second molded portion by integrally extending outward from the second molded portion. ### Claim 19 (depends on 18) The molded photosensitive assembly according to claim 18, wherein the molded reinforcement portion is integrally connected with the first molded portion, so as to form a reinforcement rib between the second outer side surface of the second molded portion and the first upper surface of the first molded portion. ### Claim 20 (depends on 16) The molded photosensitive assembly according to claim 16, further including a reinforcement adhesive piece, wherein the reinforcement adhesive piece is formed by curing an adhesive applied at the notch of the second molded portion.