# US 11,906,802 B2 · Photonics integration in semiconductor packages > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,802 B2 - Document ID: US11906802B2 - Status: Granted - Kind: B2 - Application number: 17/741,349 - Filed: 2022-05-10 - Published: 2023-11-16 - Granted: 2024-02-20 - Earliest claimed: 2022-05-10 - Assignees: Avago Technologies International Sales Pte. Limited - Applicants: Avago Technologies International Sales Pte. Limited - Inventors: Mayank Mayukh; Sam Zhao; Sam Karikalan; Reza Sharifi; Liming Tsau; Arun Ramakrishnan; Dharmendra Saraswat - Web page: https://patentgrep.com/patent/US11906802B2 ## CPC - G02B 6/428: {containing printed circuit boards [PCB]} - G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections - G02B 6/4204: {the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208)} - G02B 6/4293: {hybrid electrical and optical connections for transmitting electrical and optical signals} - G02B 6/12004: {Combinations of two or more optical elements} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler. ## Claims ### Claim 1 An apparatus comprising: a substrate comprising a first side and a second side, the substrate comprising a first layer, a core layer, and a second layer, the first layer being positioned on the first side, the second layer being positioned on the second side, and the core layer being positioned between the first layer and the second layer; an optical module coupled to the substrate, the optical module comprising a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the PIC is at least partially embedded within the core layer; and a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the substrate is an interposer. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the interposer is an organic interposer. ### Claim 4 (depends on 2) The apparatus of claim 2, wherein the interposer comprises a v-groove, and the fiber optic coupler is positioned within the v-groove. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the substrate is an optically transmissive substrate. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein the substrate is one of silicon or glass. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the substrate comprises a glass core, wherein the PIC is embedded in the glass core. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the PIC is bonded to a notch in the substrate. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein the EIC is at least partially bonded to the PIC. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the EIC coupled to the substrate, wherein the EIC is coupled to the PIC via the substrate. ### Claim 11 (depends on 1) The apparatus of claim 1, wherein the EIC is at least partially embedded within the substrate. ### Claim 12 (depends on 1) The apparatus of claim 1, wherein the core layer comprises a first area around the PIC or the EIC and a second area away from the PIC and EIC, the first area comprises a first material characterized by a first refractory index, the second area comprises a second material characterized by a second refractory index, and the first refractory index is different from the second refractory index. ### Claim 13 A semiconductor device comprising: a substrate comprising an interposer, the interposer comprising a first side and a second side, the substrate comprising a first layer, a core layer, and a second layer, the first layer being positioned on the first side, the second layer being positioned on the second side, and the core layer being positioned between the first layer and the second layer; an optical module coupled to the substrate, the optical module comprising a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the EIC is coupled to the PIC via the substrate, and the PIC is embedded within the core layer; and a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler. ### Claim 14 (depends on 13) The semiconductor device of claim 13, wherein the PIC is at least partially embedded within the interposer. ### Claim 15 (depends on 13) The semiconductor device of claim 13, wherein the PIC is bonded to a notch in the substrate. ### Claim 16 (depends on 13) The semiconductor device of claim 13, wherein the EIC is at least partially bonded to the PIC. ### Claim 17 (depends on 13) The semiconductor device of claim 13, wherein the PIC is bonded to a first side of the substrate, wherein the EIC is bonded to a second side of the substrate, wherein the second side is opposite of the first side. ### Claim 18 (depends on 13) The semiconductor device of claim 13, further a substrate, wherein the interposer is further coupled to the substrate. ### Claim 19 (depends on 13) The semiconductor device of claim 13, wherein the substrate further comprises one or more through-hole vias, wherein each of the one or more vias comprising at least part of a respective waveguide, wherein each respective waveguide is in optical communication with the PIC. ### Claim 20 A method comprising: coupling a photonic integrated circuit (PIC) of an optical module to a substrate, wherein the substrate comprises a first side and a second side, the substrate comprises a first layer, a core layer, and a second layer, the first layer is positioned on the first side, the second layer is positioned on the second side, and the core layer is positioned between the first layer and the second layer, the photonic integrated circuit is at least partially embedded within the core layer; coupling one or more fiber optic couplers to the substrate, wherein the fiber optic coupler is configured to allow the PIC to transmit or receive an optical signal via the fiber optic coupler; and bonding an electronic integrated circuit (EIC) of the optical module to the substrate, the substrate comprising one or more first routing layers.