# US 11,906,799 B2 · Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,799 B2 - Document ID: US11906799B2 - Status: Granted - Kind: B2 - Application number: 17/688,271 - Filed: 2022-03-07 - Published: 2022-06-16 - Granted: 2024-02-20 - Earliest claimed: 2020-04-07 - Assignees: Cisco Technology, Inc. - Applicants: Cisco Technology, Inc. - Inventors: Joel Richard Goergen - Web page: https://patentgrep.com/patent/US11906799B2 ## CPC - G02B 6/4268: {Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47)} - G02B 6/4214: {the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence)} - G02B 6/4293: {hybrid electrical and optical connections for transmitting electrical and optical signals} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 70/635: {Through-vias} - G02B 6/4246: {Bidirectionally operating package structures} - G02B 6/428: {containing printed circuit boards [PCB]} - G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package. ## Claims ### Claim 1 An apparatus comprising: an upper cold plate and a lower cold plate, each of the upper cold plate and the lower cold plate comprising at least one of an electrical path or an optical path extending therethrough; a substrate and die package interposed between the upper cold plate and the lower cold plate; and a power block, wherein an optical signal is delivered to or from the substrate and die package via the optical path extending through a first cold plate of the upper cold plate and the lower cold plate, and power is supplied to the substrate and die package via the electrical path extending through a second cold plate of the upper cold plate and the lower cold plate, and wherein the power block is configured to be inserted into the second cold plate and includes the electrical path that extends beyond an inner surface of the second cold plate to contact the substrate and die package. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the electrical path includes a power via formed in the power block. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the substrate and die package includes an optical engine and wherein the optical path includes a waveguide for transmitting light through the first cold plate and to or from the optical engine. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein each of the upper cold plate and the lower cold plate include the optical path and the electrical path. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein at least one of the upper cold plate and the lower cold plate includes both the optical path and the electrical path formed separately from one another. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein at least one of the electrical path or the optical path includes at least one first path extending through the upper cold plate and at least one second path extending through the lower cold plate. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the substrate and die package comprises at least one electronic integrated circuit and at least one photonic integrated circuit. ### Claim 8 An apparatus comprising: a first cold plate comprising an optical path extending therethrough; a second cold plate comprising an electrical path extending therethrough; a power block; and a substrate and die package comprising at least one electronic integrated circuit and at least one photonic integrated circuit, the substrate and die package interposed between the first cold plate and the second cold plate, wherein an optical signal is delivered to or from the substrate and die package via the optical path extending through the first cold plate and power is supplied to the substrate and die package via the electrical path extending through the second cold plate from a power delivery block inserted into the second cold plate, and wherein the power block is configured to be inserted into the second cold plate and includes the electrical path that extends beyond an inner surface of the second cold plate to contact the substrate and die package. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein the electrical path includes a power via formed in the power block. ### Claim 10 (depends on 8) The apparatus of claim 8, wherein the substrate and die package includes an optical engine and wherein the optical path includes a waveguide for transmitting light through the first cold plate and to or from the optical engine. ### Claim 11 (depends on 8) The apparatus of claim 8, wherein each of the first cold plate and the second cold plate include the optical path and the electrical path. ### Claim 12 (depends on 8) The apparatus of claim 8, wherein at least one of the first cold plate and the second cold plate includes both the optical path and the electrical path formed separately from one another. ### Claim 13 (depends on 8) The apparatus of claim 8, wherein each of the first cold plate and the second cold plate includes a plurality of electrical paths and a plurality of optical paths. ### Claim 14 A method comprising: creating an electrical path and an optical path through a first cold plate and a second cold plate; positioning the first cold plate and the second cold plate on opposite sides of a substrate and die package; transmitting power through the electrical path to the substrate and die package; and transmitting an optical signal through the optical path to and from the substrate and die package. ### Claim 15 (depends on 14) The method of claim 14, wherein creating the electrical path comprises inserting a power delivery block into one of the first cold plate and the second cold plate. ### Claim 16 (depends on 15) The method of claim 15, wherein the electrical path includes a power via formed in the power delivery block. ### Claim 17 (depends on 14) The method of claim 14, wherein creating the optical path includes inserting a waveguide for transmitting light through one of the first cold plate and the second cold plate. ### Claim 18 (depends on 14) The method of claim 14, wherein creating the electrical path and the optical path includes: creating the electrical path and the optical path through each of the first cold plate and the second cold plate. ### Claim 19 (depends on 14) The method of claim 14, further comprising: transmitting communications through the electrical path to the substrate and die package. ### Claim 20 (depends on 14) The method of claim 14, wherein creating the optical path includes inserting one or more optical path structures into an opening in one of the first cold plate and the second cold plate.