# US 11,906,745 B1 · Display backing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,745 B1 - Document ID: US11906745B1 - Status: Granted - Kind: B1 - Application number: 17/721,255 - Filed: 2022-04-14 - Granted: 2024-02-20 - Earliest claimed: 2021-04-23 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Qianyi Zhao; Runren Zhang; Zhenggang Cheng; Jeffrey A Griffis; Stephen E Dey - Web page: https://patentgrep.com/patent/US11906745B1 ## CPC - G02B 27/0172: {characterised by optical features} - G02B 27/017: {Head mounted} - G06F 3/011: {Arrangements for interaction with the human body, e.g. for user immersion in virtual reality (blind teaching G09B21/00)} - G02B 2027/014: {comprising information/image processing systems} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Display backing components for head-mounted devices (HMDs) are described that reduce eddy currents in magnetic fields generated by a coil. A HMD may include a coil that is used to generate a magnetic field that may be used to track position of other devices with respect to the HMD. Display backing components, used to provide rigidity, are modified with holes or other gaps to interrupt the path of the eddy currents and reduce the interference with the magnetic field, thus improving the power efficiency of the coil and of the HMD. These modifications may be formed by casting, drilling, cutting or otherwise perforating the display backing during manufacture. ## Claims ### Claim 1 A head-mounted device (HMD), comprising: a display; a metal backing plate; and a coil; wherein the coil is configured to generate a magnetic field; and wherein the backing plate includes at least one perforation configured to reduce an eddy current in the backing plate caused by the magnetic field, wherein the at least one perforation is placed along a path of the eddy current. ### Claim 2 (depends on 1) The HMD as recited in claim 1, wherein reducing the eddy current in the backing plate improves power efficiency of the coil. ### Claim 3 (depends on 1) The HMD as recited in claim 1, wherein the magnetic field generated by the coil is configured to be detected by an external device, wherein strength of the magnetic field at the external device indicates distance of the external device to the HMD. ### Claim 4 (depends on 1) The HMD as recited in claim 1, wherein the one or more perforations include two or more holes formed in the backing plate. ### Claim 5 (depends on 4) The HMD as recited in claim 4, wherein the holes include circular holes or elliptical holes. ### Claim 6 (depends on 4) The HMD as recited in claim 4, wherein the holes are uniform in shape and size. ### Claim 7 (depends on 4) The HMD as recited in claim 4, wherein the holes include holes of two or more different geometric shapes. ### Claim 8 (depends on 4) The HMD as recited in claim 4, wherein the holes include holes of two or more different sizes. ### Claim 9 (depends on 1) The HMD as recited in claim 1, wherein the one or more perforations include a continuous gap formed in the backing plate so that the backing plate includes two separate sections. ### Claim 10 (depends on 9) The HMD as recited in claim 9, wherein the two sections of the backing plate are connected using a non-conductive material. ### Claim 11 (depends on 10) The HMD as recited in claim 10, wherein the non-conductive material is located at one or more locations along the gap. ### Claim 12 (depends on 10) The HMD as recited in claim 10, wherein the non-conductive material is located continuously along the gap. ### Claim 13 (depends on 1) The HMD as recited in claim 1, wherein the display is configured to face a user of the HMD, the HMD further comprising a world-facing display located on an opposite side of the backing plate from the coil. ### Claim 14 (depends on 1) The HMD as recited in claim 1, further comprising a cover glass located on an opposite side of the backing plate from the coil. ### Claim 15 (depends on 1) The HMD as recited in claim 1, wherein the coil is located between the display and the metal backing plate. ### Claim 16 (depends on 1) The HMD as recited in claim 1, wherein the metal backing plate is located between the display and the coil. ### Claim 17 A system, comprising: a head-mounted device (HMD), comprising: a display; a metal backing plate; and a coil; and a peripheral device; wherein the coil is configured to generate a magnetic field; wherein the peripheral device is configured to detect the magnetic field generated by the coil to estimate distance of the peripheral device to the HMD; and wherein the backing plate includes at least one perforation configured to reduce an eddy current in the backing plate caused by the magnetic field, wherein reducing the eddy current in the backing plate improves power efficiency of the coil, wherein the at least one perforation is placed along a path of the eddy current. ### Claim 18 (depends on 17) The system as recited in claim 17, wherein the one or more perforations include two or more holes formed in the backing plate. ### Claim 19 (depends on 17) The system as recited in claim 17, wherein the one or more perforations include a continuous gap formed in the backing plate so that the backing plate includes two separate sections. ### Claim 20 A method, comprising: generating, by a coil in a head-mounted display (HMD), a magnetic field; detecting, by a peripheral device, the magnetic field generated by the coil; estimating position of the peripheral device relative to the HMD based at least in part on the detected magnetic field at the peripheral device; and causing, by the magnetic field, an eddy current in a metal backing plate of the HMD, wherein at least one perforation formed in the backing plate interferes with the eddy current caused by the magnetic field to reduce the eddy current, wherein the at least one perforation is placed along a path of the eddy current; wherein reducing the eddy current in the backing plate improves power efficiency of the coil.