System and method for rapid inspection of printed circuit board using multiple modalities

A multispectral inspection (MSI) device for inspecting an associated electronic item including a printed circuit board (PCB), the MSI device comprising:

• an electronic power supply configured to electrically power the associated electronic item in accordance with one or more test vectors;
• an optical imaging scanner configured to scan the associated electronic item, wherein the optical imaging scanner has a lateral spatial image resolution of 100 micron or finer;
• a functional imaging scanner configured to scan the associated electronic item, wherein the functional imaging scanner has a lateral spatial image resolution of 100 micron or finer;
• and
• an electronic processor programmed to:
• control the optical imaging scanner to acquire an optical image of the associated electronic item;
• control the functional imaging scanner and the electronic power supply to acquire one or more functional images of the associated electronic item powered in accord with respective one or more test vectors using the electronic power supply;
• analyze the optical image to identify areas of significance of the associated electronic item, wherein the analysis of the optical image to identify the areas of significance includes analyzing the optical image to identify electronic components mounted on the PCB;
• and
• label the identified electronic components with part identifiers using one or more of the optical image and the one or more functional images;
• wherein at least one of:
• (i) the analysis of the optical image to identify electronic components mounted on the PCB includes identifying dimensions of the identified electronic components and locations of the identified electronic components on the PCB, wherein the electronic components are labeled with part identifiers based at least in part on the dimensions of the identified electronic components, and/or
• (ii) the analysis of the optical image to identify electronic components mounted on the PCB further includes identifying numbers of pins of the identified electronic components, wherein the electronic components are labeled with part identifiers based at least in part on the numbers of pins of the identified electronic components.

A multispectral inspection (MSI) device for inspecting an associated Commercial Off The Shelf (COTS) product including a printed circuit board (PCB), the MSI device comprising:

• an electronic power supply configured to electrically power the associated COTS product in accordance with one or more test vectors;
• an optical imaging scanner configured to scan the associated COTS product, wherein the optical imaging scanner has a lateral spatial image resolution of 100 micron or finer;
• a functional imaging scanner configured to scan the associated COTS product, wherein the functional imaging scanner has a lateral spatial image resolution of 100 micron or finer;
• and
• an electronic processor programmed to:
• control the optical imaging scanner to acquire an optical image of the associated COTS product;
• control the functional imaging scanner and the electronic power supply to acquire one or more functional images of the associated COTS product powered in accord with respective one or more test vectors using the electronic power supply;
• analyze the optical image to identify areas of significance of the associated COTS product, wherein the analysis of the optical image to identify the areas of significance includes analyzing the optical image to identify electronic components mounted on the PCB;
• label the identified electronic components with part identifiers using one or more of the optical image and the one or more functional images;
• compare the labeled part identifiers with a bill of materials (BOM) for the associated COTS product;
• and
• output a BOM compliance report summarizing the comparison with the BOM.

A multi-spectral inspection (MSI) method performed on an associated electronic item having a printed circuit board (PCB), the MSI method comprising:

• controlling an optical imaging scanner to acquire an optical image of the associated electronic item;
• analyzing the optical image to identify areas of significance of the associated electronic item;
• controlling a functional imaging scanner and an electronic power supply to acquire functional area images of the areas of significance with the associated electronic item powered in accord with one or more test vectors using the electronic power supply;
• generating a functional image for each test vector by combining the functional images acquired with the associated electronic item powered in accord with that test vector;
• generating a three-dimensional (3D) signature for the associated electronic item comprising a stack of the optical image and the functional images at the one or more test vectors;
• and
• performing at least one MSI analysis by processing the 3D signature using one or more artificial intelligence (AI) classifiers;
• wherein the associated electronic item is an instance of a Commercial Off-The-Shelf (COTS) product, and the performing of the at least one MSI analysis includes performing a revision identification analysis by processing the 3D signature using one or more AI classifiers trained on 3D signatures generated for different revisions of the COTS product each labeled by the respective revision.

A non-transitory storage medium storing instructions readable and executable by an electronic processor to perform a multispectral inspection (MSI) method of an associated electronic item having a printed circuit board (PCB), the MSI method comprising:

• controlling an optical imaging scanner to acquire an optical image of the associated electronic item;
• analyzing the optical image to identify electronic components mounted on the PCB, locations of the electronic components on the PCB, and structural metrics of the electronic components;
• performing optical character recognition (OCR) on the optical image to identify textual content with associated locations on the PCB;
• and
• labeling the identified electronic components with part identifiers based at least on the structural metrics of the electronic components and the textual content with associated locations on the PCB, wherein the structural metrics include dimensions of the identified electronic components and numbers of pins of the identified electronic components.

A non-transitory storage medium storing instructions readable and executable by an electronic processor to perform a multispectral inspection (MSI) method of an associated Commercial Off-The-Shelf (COTS) product having a printed circuit board (PCB), the MSI method comprising:

• controlling an optical imaging scanner to acquire an optical image of the associated COTS product;
• analyzing the optical image to identify electronic components mounted on the PCB, locations of the electronic components on the PCB, and structural metrics of the electronic components;
• performing optical character recognition (OCR) on the optical image to identify textual content with associated locations on the PCB;
• labeling the identified electronic components with part identifiers based at least on the structural metrics of the electronic components and the textual content with associated locations on the PCB;
• comparing the identified and labeled electronic components with a bill of materials (BOM) for the associated COTS product;
• and
• generating a BOM compliance report for the associated COTS product based on the comparison.

A non-transitory storage medium storing instructions readable and executable by an electronic processor to perform a multispectral inspection (MSI) method of an associated electronic item having a printed circuit board (PCB), the MSI method comprising:

• controlling an optical imaging scanner to acquire an optical image of the associated electronic item;
• analyzing the optical image to identify electronic components mounted on the PCB, locations of the electronic components on the PCB, and structural metrics of the electronic components;
• performing optical character recognition (OCR) on the optical image to identify textual content with associated locations on the PCB;
• and
• labeling the identified electronic components with part identifiers based at least on the structural metrics of the electronic components and the textual content with associated locations on the PCB;
• wherein the labeling comprises:
• labeling the identified electronic components with first candidate part identifiers based on the metrics of the electronic components but not based on the textual content with associated locations on the PCB;
• labeling the identified electronic components with second candidate part identifiers based on the textual content with associated locations on the PCB but not based on the metrics of the electronic components;
• and
• generating an assessment report for the associated electronic item identifying any differences between the first candidate part identifiers and the second candidate part identifiers.