Hybrid socket warp indicator

A method comprising:

• forming a printed circuit board assembly comprising a warp indicator and a socket, the warp indicator comprising an element manufactured to be damaged when subjected to a predetermined amount of force, wherein the predetermined amount of force corresponds to an out-of-tolerance warpage of the printed circuit board;
• subjecting the printed circuit board assembly to a thermal event, the thermal event resulting in the out-of-tolerance warpage of the printed circuit board and at least the predetermined amount of force being applied to the warp indicator, causing the element to fracture;
• determining that the element was damaged during the thermal event, wherein determining that the element was damaged comprises visually inspecting the element to confirm the fracture, thereby allowing for a non-invasive visual confirmation that the socket was subjected to the out-of-tolerance warpage;
• and
• in response to determining that the element was damaged, indicating a defective warpage condition for the printed circuit board assembly.