# US 11,906,573 B2 · Testing module and testing method using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,573 B2 - Document ID: US11906573B2 - Status: Granted - Kind: B2 - Application number: 18/161,839 - Filed: 2023-01-30 - Published: 2023-06-01 - Granted: 2024-02-20 - Earliest claimed: 2019-08-29 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Hao Chen; Mill-Jer Wang - Web page: https://patentgrep.com/patent/US11906573B2 ## CPC - G01R 31/275: {for testing individual semiconductor components within integrated circuits} - G01R 1/0466: {concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding} - G01R 1/0491: {for testing integrated circuits on wafers, e.g. wafer-level test cartridge} - G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. The circuit board structure includes two edge regions and a main region located therebetween. The first connectors are located over the edge regions and connected to the circuit board structure. The first connecting structure is located over and distant from the circuit board structure. The second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. The first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors. ## Claims ### Claim 1 A testing module for a semiconductor wafer-form package, comprising: a circuit board structure; first connectors, disposed over the circuit board structure and connected to the circuit board structure; a first connecting structure, disposed over and distant from the circuit board structure; second connectors and third connectors, disposed over and connected to the first connecting structure, wherein the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the circuit board structure; and a first bridge connector, electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors, wherein the semiconductor wafer-form package is surrounded by the circuit board structure, the first connectors, the first bridge connector, the first connecting structure, the second connectors, and the third connectors. ### Claim 2 (depends on 1) The testing module of claim 1, wherein the first bridge connector comprises a plurality of parallel conductive wires. ### Claim 3 (depends on 1) The testing module of claim 1, wherein the first connecting structure comprises a circuit board or a plurality of parallel conductive wires. ### Claim 4 (depends on 1) The testing module of claim 1, wherein the semiconductor wafer-form package comprises fourth connectors and at least one socket surrounded by the fourth connectors, and wherein the third connectors are electrically coupled to the fourth connectors for forming a temporarily electrical connection with the semiconductor wafer-form package, and the third connectors independently are overlapped with a respective one of the fourth connectors along a stacking direction of the semiconductor wafer-form package and the testing module. ### Claim 5 (depends on 4) The testing module of claim 4, further comprising: a second bridge connector, disposed over the circuit board structure and electrically connected to the first connecting structure through the semiconductor wafer-form package, wherein the second bridge connector comprises a substrate with a circuitry embedded therein and a plurality of pins disposed over the substrate and electrically connected to the circuitry, wherein the semiconductor wafer-form package is disposed inside a space confined by the circuit board structure, the first connectors, the first bridge connector, the first connecting structure, the second connectors, the third connectors and the second connecting structure. ### Claim 6 (depends on 5) The testing module of claim 5, wherein the second bridge connector is removably installed into the at least one socket of the semiconductor wafer-form package, and the pins are respectively inserted into through holes of the at least one socket for forming a further temporarily electrical connection with the semiconductor wafer-form package. ### Claim 7 (depends on 1) The testing module of claim 1, further comprising: an elastic element, disposed over the circuit board structure, wherein the elastic element is sandwiched between the semiconductor wafer-form package and the circuit board structure. ### Claim 8 A testing module for a semiconductor wafer-form package, comprising: a circuit board structure, comprising two edge regions and a main region disposed therebetween; first connectors, disposed over the edge regions and connected to the circuit board structure; a first connecting structure, disposed over and distant from the circuit board structure; second connectors and third connectors, disposed over and in contact with the first connecting structure, wherein the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region; and a first bridge connector, electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors, wherein a projection of the semiconductor wafer-form package is overlapped with the third connectors along a stacking direction of the circuit board structure and the first connectors. ### Claim 9 (depends on 8) The testing module of claim 8, wherein the first bridge connector comprises a plurality of parallel conductive wires. ### Claim 10 (depends on 8) The testing module of claim 8, wherein the first connecting structure comprises a circuit board or a plurality of parallel conductive wires. ### Claim 11 (depends on 8) The testing module of claim 8, wherein the semiconductor wafer-form package is located in an accommodating space confined by the first connecting structure, the first bridge connector and the circuit board structure and comprises fourth connectors and at least one socket surrounded by the fourth connectors, and wherein the third connectors are removably and directly installed on the fourth connectors of the semiconductor wafer-form package for forming a temporarily electrical connection with the semiconductor wafer-form package, and the third connectors independently are overlapped with a respective one of the fourth connectors along the stacking direction. ### Claim 12 (depends on 11) The testing module of claim 11, further comprising: a second bridge connector, disposed over the main region and electrically connected to the first connecting structure through the semiconductor wafer-form package, wherein the second bridge connector comprises a substrate with a circuitry embedded therein and a plurality of pins disposed over the substrate and electrically connected to the circuitry. ### Claim 13 (depends on 12) The testing module of claim 12, wherein the second bridge connector is removably installed into the at least one socket of the semiconductor wafer-form package, and the pins are respectively inserted into through holes of the at least one socket for forming a further temporarily electrical connection with the semiconductor wafer-form package. ### Claim 14 (depends on 8) The testing module of claim 8, further comprising: an elastic element, disposed over the main region, wherein the elastic element is sandwiched between the semiconductor wafer-form package and the circuit board structure. ### Claim 15 A testing module for a semiconductor wafer-form package, comprising: a circuit board structure, comprising two edge regions and a main region disposed therebetween; first connectors, disposed over the edge regions and connected to the circuit board structure; a first connecting structure, disposed over and distant from the circuit board structure; second connectors and third connectors, disposed over and in contact with the first connecting structure, wherein the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region; a first bridge connector, electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors; and an elastic element, disposed over the main region, wherein the elastic element is sandwiched between the semiconductor wafer-form package and the circuit board structure, wherein a projection of the semiconductor wafer-form package is overlapped with the first connecting structure along a stacking direction of the circuit board structure and the first connectors. ### Claim 16 (depends on 15) The testing module of claim 15, wherein the first bridge connector comprises a plurality of parallel conductive wires. ### Claim 17 (depends on 15) The testing module of claim 15, wherein the first connecting structure comprises a circuit board or a plurality of parallel conductive wires. ### Claim 18 (depends on 15) The testing module of claim 15, wherein the semiconductor wafer-form package is located in an accommodating space confined by the first connecting structure, the first bridge connector and the circuit board structure and comprises fourth connectors and at least one socket surrounded by the fourth connectors, and wherein the third connectors are removably and directly installed on the fourth connectors of the semiconductor wafer-form package for forming a temporarily electrical connection with the semiconductor wafer-form package, and the third connectors independently are overlapped with a respective one of the fourth connectors along the stacking direction. ### Claim 19 (depends on 18) The testing module of claim 18, further comprising: a second bridge connector, disposed over the main region and electrically connected to the first connecting structure through the semiconductor wafer-form package, wherein the second bridge connector comprises a substrate with a circuitry embedded therein and a plurality of pins disposed over the substrate and electrically connected to the circuitry. ### Claim 20 (depends on 19) The testing module of claim 19, wherein the second bridge connector is removably installed into the at least one socket of the semiconductor wafer-form package, and the pins are respectively inserted into through holes of the at least one socket for forming a further temporarily electrical connection with the semiconductor wafer-form package.