# US 11,906,547 B2 · Systems, apparatuses, or components for electrolytic corrosion protection of electronic element testing apparatuses > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,547 B2 - Document ID: US11906547B2 - Status: Granted - Kind: B2 - Application number: 17/737,047 - Filed: 2022-05-05 - Published: 2023-11-09 - Granted: 2024-02-20 - Earliest claimed: 2022-05-05 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Minh Nhat Dang; Thi Mien Tran - Web page: https://patentgrep.com/patent/US11906547B2 ## CPC - G01R 1/04: Housings; Supporting members; Arrangements of terminals - G01R 1/0408: {Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808)} - C23F 13/06: Constructional parts, or assemblies of cathodic-protection apparatus - G01R 31/2849: {Environmental or reliability testing, e.g. burn-in or validation tests (of individual semiconductors G01R31/2642; of printed circuits boards G01R31/2817; of IC's G01R31/2855)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ## Abstract An apparatus includes a tester chassis connected to a chassis electric reference potential for electrostatic discharge grounding of the tester chassis; a thermal head assembly coupled to the tester chassis, the thermal head assembly having a metallic thermal contact surface; and an electrical insulation arrangement disposed between the metallic thermal contact surface and the chassis electric reference potential to electrically insulate the metallic thermal contact from the chassis electric reference potential. An electrolytic corrosion protection system for the apparatus and a cable assembly for the apparatus. ## Claims ### Claim 1 An apparatus comprising: a tester chassis connected to a chassis electric reference potential for electrostatic discharge grounding of the tester chassis; a thermal head assembly coupled to the tester chassis, the thermal head assembly having a metallic thermal contact surface; and an electrical insulation arrangement disposed between the metallic thermal contact surface and the chassis electric reference potential to electrically insulate the metallic thermal contact from the chassis electric reference potential. ### Claim 2 (depends on 1) The apparatus as claimed in claim 1, further comprising a device-under-test (DUT) connector connectable with a DUT, wherein the thermal head assembly is operable to move the metallic thermal contact surface to contact the DUT when the DUT is connected to the DUT connector; and a test unit connected to the DUT connector for communicating with the DUT when the DUT is connected to the DUT connector, the test unit having a test circuit electric reference potential serving as a circuit ground for the test unit, wherein an electric potential difference exists between the chassis electric reference potential and the test circuit electric reference potential. ### Claim 3 (depends on 1) The apparatus as claimed in claim 1, wherein the electrical insulation arrangement comprises a circuit path connecting the metallic thermal contact surface to the chassis electric reference potential, wherein the circuit path comprises a predetermined resistor connected between the metallic thermal contact surface and the chassis electric reference potential. ### Claim 4 (depends on 3) The apparatus as claimed in claim 3, wherein the circuit path is embodied as a cable. ### Claim 5 (depends on 4) The apparatus as claimed in claim 4, wherein the cable comprises a wire part with the predetermined resistor disposed along the wire part; and a cable jacket wrapped over the wire part. ### Claim 6 (depends on 5) The apparatus as claimed in claim 5, wherein the cable comprises a first connector at an end of the cable, and a second connector at an opposite end of the cable. ### Claim 7 (depends on 1) The apparatus as claimed in claim 1, wherein the electrical insulation arrangement comprises one or a combination of electrically non-conductive hardware elements including a non-conductive spacer, a non-conductive washer, a non-conductive fastener, a non-conductive linkage, a non-conductive connector, or a non-conductive coupling disposed at any one of a joint or mechanical connection anywhere between the metallic thermal contact surface and the tester chassis to establish an electrical insulation barrier between the metallic thermal contact surface and the chassis electric reference potential. ### Claim 8 (depends on 1) The apparatus as claimed in claim 1, wherein the thermal head assembly comprises a head unit comprising a contact member having the metallic thermal contact surface; and an electric heater coupled to the contact member. ### Claim 9 (depends on 8) The apparatus as claimed in claim 8, wherein the electrical insulation arrangement is configured to electrically insulate the metallic thermal contact from the chassis electric reference potential when a potential across the electrical insulation arrangement is within a predetermined range, the electrical insulation arrangement comprises a parallel circuit connecting the head unit to the chassis electric reference potential, wherein the parallel circuit comprises a first path with a predetermined resistor connected between the head unit and the chassis electric reference potential, and a second path with two oppositely oriented Zener diodes connected in series between the head unit and the chassis electric reference potential, the first path and the second path being electrically parallel paths. ### Claim 10 (depends on 9) The apparatus as claimed in claim 9, wherein the parallel circuit is embodied as a cable with a first end of the cable connected to the head unit and a second end of the cable connected to the chassis electric reference potential. ### Claim 11 (depends on 10) The apparatus as claimed in claim 10, wherein the cable comprises a first wire part with the predetermined resistor disposed along the first wire part; a second wire part with the two oppositely oriented Zener diodes connected in series along the second wire part, wherein an end of the first wire part and a corresponding end of the second wire part are connected together to form a first node and an opposite end of the first wire part and a corresponding opposite end of the second wire part are connected together to form a second node, wherein the first wire part and the second wire part are shielded from each other; and a cable jacket wrapped over the first wire part and the second wire part to bundle the first wire part and the second wire part together. ### Claim 12 (depends on 11) The apparatus as claimed in claim 11, wherein the cable comprises a first connector at the first end of the cable, the first connector being connected to the first node, and a second connector at the second end of the cable, the second connector being connected to the second node. ### Claim 13 (depends on 8) The apparatus as claimed in claim 8, wherein the electrical insulation arrangement comprises one or a combination of electrically non-conductive hardware elements including a non-conductive spacer, a non-conductive washer, a non-conductive fastener, a non-conductive linkage, a non-conductive connector, or a non-conductive coupling disposed at any one of a joint or mechanical connection anywhere between the head unit and the tester chassis to establish an electrical insulation barrier between the metallic thermal contact surface and the chassis electric reference potential. ### Claim 14 A cable assembly comprising: a first wire segment; a second wire segment; and a parallel circuit connected between the first wire segment and the second wire segment, the parallel circuit having a first path with a predetermined resistor connected between a first node and a second node, and a second path with two oppositely oriented Zener diodes connected in series between the first node and the second node, the first path and the second path being electrically parallel paths, wherein the first wire segment is connected to the first node and the second wire segment is connected to the second node. ### Claim 15 (depends on 14) The cable assembly as claimed in claim 14, further comprising a first wire part with the predetermined resistor disposed along the first wire part; a second wire part with the two oppositely oriented Zener diodes connected in series along the second wire part, wherein an end of the first wire part and a corresponding end of the second wire part are connected together to form the first node and an opposite end of the first wire part and a corresponding opposite end of the second wire part are connected together to form the second node, wherein the first wire part and the second wire part are shielded from each other; and a cable jacket wrapped over the first wire part and the second wire part to bundle the first wire part and the second wire part together. ### Claim 16 (depends on 15) The cable assembly as claimed in claim 15, further comprising a first connector at a free end of the first wire segment, and a second connector at a free end of the second wire segment. ### Claim 17 A system comprising: a test circuit configured to receive a device-under-test (DUT) and to run test programs on the DUT, the test circuit having a test circuit electric reference potential serving as a circuit ground for the test circuit; a metallic thermal contact surface configured to contact the DUT connected to the test circuit and operable to regulate a temperature of the DUT when in contact with the DUT during testing; a chassis electric reference potential for electrostatic discharge grounding of a tester chassis; and an electrical insulation arrangement connected between the metallic thermal contact surface and the chassis electric reference potential to insulate the metallic thermal contact surface from the chassis electric reference potential, wherein an electric potential difference exists between the chassis electric reference potential and the test circuit electric reference potential. ### Claim 18 (depends on 17) The system as claimed in claim 17, further comprising a heater circuit configured to control a temperature of the metallic thermal contact surface for regulating the temperature of the DUT when in contact with the DUT during testing. ### Claim 19 (depends on 18) The system as claimed in claim 18, wherein the electrical insulation arrangement is configured to electrically insulate the metallic thermal contact from the chassis electric reference potential when a potential across the electrical insulation arrangement is within a predetermined range, the electrical insulation arrangement comprises a parallel circuit connecting the metallic thermal contact surface to the chassis electric reference potential, wherein the parallel circuit comprises a first path with a predetermined resistor connected between the metallic thermal contact surface and the chassis electric reference potential, and a second path with two oppositely oriented Zener diodes connected in series between the metallic thermal contact surface and the chassis electric reference potential, the first path and the second path being electrically parallel paths. ### Claim 20 (depends on 17) The system as claimed in claim 17, wherein the electrical insulation arrangement comprises one or a combination of electrically non-conductive hardware elements including a non-conductive spacer, a non-conductive washer, a non-conductive fastener, a non-conductive linkage, a non-conductive connector, or a non-conductive coupling disposed at any one of a joint or mechanical connection anywhere between the metallic thermal contact surface and the tester chassis to establish an electrical insulation barrier between the metallic thermal contact surface and the chassis electric reference potential.