# US 11,906,538 B2 · Sensor module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,906,538 B2 - Document ID: US11906538B2 - Status: Granted - Kind: B2 - Application number: 17/577,779 - Filed: 2022-01-18 - Published: 2022-07-21 - Granted: 2024-02-20 - Earliest claimed: 2021-01-20 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Masayasu Sakuma - Web page: https://patentgrep.com/patent/US11906538B2 ## CPC - G01P 15/0802: {Details} - G01P 15/18: in two or more dimensions - G01C 19/5783: Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719 - G01P 1/023: {for acceleration measuring devices} - G01P 3/44: for measuring angular speed (G01P3/56 takes precedence) - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) - G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S) ## Abstract A sensor module includes: a printed circuit board having a first recessed portion formed at a first side, a second recessed portion formed at a second side facing the first side, a third recessed portion formed at a third side, and a fourth recessed portion formed at a fourth side facing the third side; a metal cap including convex portions each bonded to a respective one of the first to fourth recessed portions; and a first inertial sensor and a second inertial sensor that are provided at a main surface of the printed circuit board. The first inertial sensor and the second inertial sensor are disposed outside a region surrounded by a line connecting both ends of the first recessed portion and the second recessed portion and outside a region surrounded by a line connecting both ends of the third recessed portion and the fourth recessed portion. ## Claims ### Claim 1 A sensor module, comprising: a rectangular printed circuit board that has a main surface, a first recessed portion formed at a first side of the main surface, a second recessed portion formed at a second side facing the first side in an X-axis direction of the rectangular printed circuit board, a third recessed portion formed at a third side adjacent to the first side and the second side, and a fourth recessed portion formed at a fourth side facing the third side in a Y-axis direction of the rectangular printed circuit board; a metal cap that includes a first convex portion bonded to the first recessed portion of the printed circuit board, a second convex portion bonded to the second recessed portion, a third convex portion bonded to the third recessed portion, and a fourth convex portion bonded to the fourth recessed portion; adhesive members interposed between and contacting the first convex portion and the first recessed portion, the second convex portion and the second recessed portion, the third convex portion and the third recessed portion, and the fourth convex portion and the fourth recessed portion, respectively; a first inertial sensor that is provided at the main surface of the printed circuit board and that is accommodated between the main surface and the metal cap; and a second inertial sensor that is provided at the main surface of the printed circuit board and that is accommodated between the main surface and the metal cap, wherein in a plan view from a Z-axis direction orthogonal to the main surface of the printed circuit board, the first inertial sensor and the second inertial sensor are disposed outside a first region and a second region, wherein the first region is defined between a first line segment and a second line segment, the first line segment connecting one end of the first recessed portion of the printed circuit board in the Y-axis direction and one end of the second recessed portion of the printed circuit board in the Y-axis direction, and the second line segment connecting another end of the first recessed portion of the printed circuit board in the Y-axis direction and another end of the second recessed portion of the printed circuit board in the Y-axis direction, and the second region is defined between a third line segment and a fourth line segment, the third line segment connecting one end of the third recessed portion in the X-axis direction and one end of the fourth recessed portion in the X-axis direction, and the fourth line segment connecting another end of the third recessed portion in the X-axis direction and another end of the fourth recessed portion in the X-axis direction, and the first region and the second region separate a first mounting region and a second mounting region from each other wherein the first inertial sensor is provided in the first mounting region and the second inertial sensor is provided in the second mounting region. ### Claim 2 (depends on 1) The sensor module according to claim 1, wherein the first inertial sensor includes a first acceleration sensor element, and a first electrode electrically coupled to the first acceleration sensor element, in the plan view, the first acceleration sensor element and the first electrode are disposed side by side in the Y-axis direction, the first acceleration sensor element is disposed, in the first Y axis direction, at a position that is closer to an outer edge of the printed circuit board, that is a nearest outer edge of the printed circuit board to the first inertial sensor in the Y-axis direction, than is the first electrode, the second inertial sensor includes a second acceleration sensor element, and a second electrode electrically coupled to the second acceleration sensor element, in the plan view, the second acceleration sensor element and the second electrode are disposed side by side in the X-axis direction, and the second acceleration sensor element is disposed, in the X axis direction, at a position that is closer to an outer edge of the printed circuit board, that is a nearest outer edge of the printed circuit board to the second inertial sensor in the X-axis direction, than is the second electrode. ### Claim 3 (depends on 1) The sensor module according to claim 1, wherein the first inertial sensor includes a first acceleration sensor element, and a first angular velocity sensor element, in the plan view, the first acceleration sensor element and the first angular velocity sensor element are disposed side by side in the X-axis direction, the first acceleration sensor element is disposed, in the X-axis direction, at a position that is closer to an outer edge of the printed circuit board, that is a nearest outer edge of the printed circuit board to the first inertial sensor in the X-axis direction, than is the first angular velocity sensor element, the second inertial sensor includes a second acceleration sensor element, and a second angular velocity sensor element, in the plan view, the second acceleration sensor element and the second angular velocity sensor element are disposed side by side in the Y-axis direction, and the second acceleration sensor element is disposed, in the Y-axis direction, at a position that is closer to an outer edge of the printed circuit board, that is a nearest outer edge of the printed circuit board to the second inertial sensor in the Y-axis direction, than is the second angular velocity sensor element.