# US 11,906,383 B2 · Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method

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- Number: US 11,906,383 B2
- Document ID: US11906383B2
- Status: Granted
- Kind: B2
- Application number: 17/282,870
- Filed: 2020-01-20
- Published: 2021-11-11
- Granted: 2024-02-20
- Earliest claimed: 2019-01-31
- Assignees: Robert Bosch GmbH
- Applicants: Robert Bosch GmbH
- Inventors: Stefan Pinter; Nico Greiner
- Web page: https://patentgrep.com/patent/US11906383B2

## CPC

- B81C 1/00238: {Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure}
- G01L 9/0052: {of piezoresistive elements (circuits therefor G01L9/06)}
- B81B 7/0048: {between the MEMS die and the substrate}
- B81B 7/0058: {for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations}
- B81B 7/0064: {for protecting against electromagnetic or electrostatic interferences}
- B81C 1/00269: {Bonding of solid lids or wafers to the substrate}
- B81C 1/00325: {for reducing stress inside of the package structure}
- B81B 2201/0264: Pressure sensors
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- B81B 2207/098: Arrangements not provided for in groups B81B2207/092 - B81B2207/097
- B81C 2203/0109: Bonding an individual cap on the substrate
- B81C 2203/0118: Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
- B81C 2203/0785: Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
- B81C 2203/0792: Forming interconnections between the electronic processing unit and the micromechanical structure
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device is fitted with a substrate including a front side and a rear side; a micromechanical sensor chip including a sensor area attached to the front side of the substrate; and a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip. The capping unit surrounds the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip. A mold package is formed above the capping unit.

## Claims

### Claim 1

A micromechanical sensor device, comprising:
a substrate including a front side and a rear side;
a micromechanical sensor chip including a sensor area attached to the front side of the substrate;
a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip; and
a mold package formed above the capping unit,
wherein the ASIC chip partially covers the micromechanical sensor chip and includes a recess, which has a u-shaped edge area, which is directly attached to the front side of the substrate, and an open portion of the u-shaped edge area is attached directly to the micromechanical sensor chip.

### Claim 2 (depends on 1)

The micromechanical sensor device as recited in claim 1, wherein the ASIC chip has a trough-like recess, which includes a circumferential ring-shaped edge area, which is attached indirectly or directly to the front side of the substrate.

### Claim 3 (depends on 1)

The micromechanical sensor device as recited in claim 1, wherein the ASIC chip has a planar design and is attached to the front side of the substrate via a ring-shaped spacer unit.

### Claim 4 (depends on 1)

The micromechanical sensor device as recited in claim 1, wherein the ASIC chip partially covers the micromechanical sensor chip and has a planar design and is attached via a u-shaped spacer unit directly to the front side of the substrate, and the ASIC chip is directly attached to the micromechanical sensor chip in an open portion of the u-shaped spacer unit.

### Claim 5 (depends on 1)

The micromechanical sensor device as recited in claim 1, wherein the micromechanical sensor chip is bonded onto the front side of the substrate in a linear and/or punctiform manner.

### Claim 6 (depends on 1)

The micromechanical sensor device as recited in claim 1, wherein the micromechanical sensor chip is a pressure sensor chip.

### Claim 7 (depends on 1)

The micromechanical sensor device as recited in claim 1, wherein the substrate is an line grid array (LGA) substrate.

### Claim 8

A micromechanical, comprising:
a substrate including a front side and a rear side;
a micromechanical sensor chip including a sensor area attached to the front side of the substrate;
a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip; and
a mold package formed above the capping unit,
wherein a through-opening in the substrate forms a media access opening to the cavity toward the rear side of the substrate.

### Claim 9 (depends on 8)

The micromechanical sensor device as recited in claim 8, wherein a microporous diaphragm is attached above the through-opening on the rear side of the substrate.

### Claim 10

A method for manufacturing a micromechanical sensor device, comprising the following steps:
providing a substrate including a front side and a rear side;
attaching a micromechanical sensor chip including a sensor area to the front side of the substrate;
forming a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip; and
forming a mold package above the capping unit,
wherein the ASIC chip partially covers the micromechanical sensor chip and includes a recess, which has a u-shaped edge area, which is directly attached to the front side of the substrate, and an open portion of the u-shaped edge area is attached directly to the micromechanical sensor chip.

### Claim 11 (depends on 10)

The method as recited in claim 10, wherein the ASIC chip includes a trough-like recess, which includes a circumferential ring-shaped edge area, which is attached indirectly or directly to the front side of the substrate.

### Claim 12 (depends on 10)

The method as recited in claim 10, wherein the ASIC chip has a planar design and is attached to the front side of the substrate via a ring-shaped spacer unit.

### Claim 13 (depends on 10)

The method as recited in claim 10, wherein the ASIC chip partially covers the micromechanical sensor chip and has a planar design, and is attached directly to the front side of the substrate via a u-shaped spacer unit, and the ASIC chip is attached directly to the micromechanical sensor chip in an open portion of the u-shaped spacer unit.