# US 11,906,373 B2 · Pressure sensor and electronic equipment

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,906,373 B2
- Document ID: US11906373B2
- Status: Granted
- Kind: B2
- Application number: 16/705,758
- Filed: 2019-12-06
- Published: 2020-04-09
- Granted: 2024-02-20
- Earliest claimed: 2017-07-26
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Hiroaki Kitada
- Web page: https://patentgrep.com/patent/US11906373B2

## CPC

- G01L 1/16: using properties of piezoelectric devices
- G06F 3/0414: {using force sensing means to determine a position}
- H10N 30/302: {Sensors}
- H10N 30/706: {characterised by the underlying bases, e.g. substrates}
- H10N 30/857: Macromolecular compositions
- H10N 30/87: Electrodes or interconnections, e.g. leads or terminals
- H10N 30/883: {Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings}
- G06F 2203/04107: Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

A pressure sensor that includes a piezoelectric film having a first main surface and a second main surface, a first electrode on the first main surface of the piezoelectric film, and a second electrode on the second main surface of the piezoelectric film. At least one of the first electrode and the second electrode is formed of a material having an elastic modulus of 60 GPa or more, and the product of a thickness of the at least one of the first electrode and the second electrode in a stacking direction of the pressure sensor multiplied by an elastic modulus of the at least one of the first electrode and the second electrode is 4 MPa·m or more.

## Claims

### Claim 1

A pressure sensor comprising:
a piezoelectric film having a first main surface and a second main surface;
a first electrode on the first main surface of the piezoelectric film; and
a second electrode on the second main surface of the piezoelectric film,
wherein
at least one of the first electrode and the second electrode is formed of a material having an elastic modulus of 60 GPa or more, and a product of a thickness of the least one of the first electrode and the second electrode in a stacking direction of the pressure sensor multiplied by the elastic modulus of the least one of the first electrode and the second electrode is 4 MPa*m or more.

### Claim 2 (depends on 1)

The pressure sensor according to claim 1, wherein both the first electrode and the second electrode are each formed of the material having the elastic modulus of 60 GPa or more, and each of the product of the thickness of the first electrode multiplied by the elastic modulus of the first electrode and the product of the thickness of the second electrode multiplied by the elastic modulus of the second electrode is 4 MPa*m or more.

### Claim 3 (depends on 1)

The pressure sensor according to claim 1, wherein each of the product of the thickness of the first electrode multiplied by the elastic modulus of the first electrode and the product of the thickness of the second electrode multiplied by the elastic modulus of the second electrode is 5 MPa*m or more.

### Claim 4 (depends on 1)

The pressure sensor according to claim 1, wherein the product of the thickness of the least one of the first electrode and the second electrode in the stacking direction multiplied by the elastic modulus of the least one of the first electrode and the second electrode is 5 MPa*m or more.

### Claim 5 (depends on 1)

The pressure sensor according to claim 1, wherein the first electrode includes:
a third main surface facing the piezoelectric film; and
a fourth main surface opposite the third main surface; and
the pressure sensor further comprises a shield electrode arranged so as to face the fourth main surface,
the shield electrode is formed of a second material having an elastic modulus of 60 GPa or more, and
the shield electrode has a product of a thickness of the shield electrode in a stacking direction of the pressure sensor multiplied by the elastic modulus of the shield electrode is 4 MPa*m or more.

### Claim 6 (depends on 5)

The pressure sensor according to claim 5, wherein the product of the thickness of the shield electrode in the stacking direction of the pressure sensor multiplied by the elastic modulus of the shield electrode is 5 MPa*m or more.

### Claim 7 (depends on 5)

The pressure sensor according to claim 5, wherein
the shield electrode comprises a plurality of electrode layers, and
a sum of products of thicknesses of the plurality of electrode layers in the stacking direction of the pressure sensor multiplied by elastic moduli of the plurality of electrode layers is 4 MPa*m or more.

### Claim 8 (depends on 7)

The pressure sensor according to claim 7, wherein the sum of the products of thicknesses of the plurality of electrode layers in the stacking direction of the pressure sensor multiplied by the elastic moduli of the plurality of electrode layers is 5 MPa*m or more.

### Claim 9 (depends on 7)

The pressure sensor according to claim 7, further comprising:
a resin substrate between the shield electrode and the first electrode; and
a via electrode connecting the shield electrode and first electrode.

### Claim 10 (depends on 9)

The pressure sensor according to claim 9, wherein
the resin substrate, the shield electrode, the via electrode, and the first electrode are formed of a printed wiring board, and
the resin substrate includes at least one of epoxy resin, polyimide, and a liquid crystal polymer.

### Claim 11 (depends on 7)

The pressure sensor according to claim 7, further comprising:
a resin substrate between the shield electrode and the first electrode;
a reference electrode pattern arranged in a same plane as the first electrode; and
a via electrode connecting the shield electrode and the reference electrode pattern,
wherein
the second electrode is formed of a conductive tape and is connected to the reference electrode pattern.

### Claim 12 (depends on 11)

The pressure sensor according to claim 11, wherein
the resin substrate, the shield electrode, the via electrode, the reference electrode pattern, and the first electrode are formed of a printed wiring board, and
the resin substrate includes at least one of epoxy resin, polyimide, and a liquid crystal polymer.

### Claim 13 (depends on 11)

The pressure sensor according to claim 11, wherein the conductive tape is a double-sided tape.

### Claim 14 (depends on 5)

The pressure sensor according to claim 5, further comprising:
a resin substrate between the shield electrode and the first electrode; and
a via electrode connecting the shield electrode and first electrode.

### Claim 15 (depends on 14)

The pressure sensor according to claim 14, wherein
the resin substrate, the shield electrode, the via electrode, and the first electrode are formed of a printed wiring board, and
the resin substrate includes at least one of epoxy resin, polyimide, and a liquid crystal polymer.

### Claim 16 (depends on 5)

The pressure sensor according to claim 5, further comprising:
a resin substrate between the shield electrode and the first electrode;
a reference electrode pattern arranged in a same plane as the first electrode; and
a via electrode connecting the shield electrode and the reference electrode pattern,
wherein
the second electrode is formed of a conductive tape and is connected to the reference electrode pattern.

### Claim 17 (depends on 16)

The pressure sensor according to claim 16, wherein
the resin substrate, the shield electrode, the via electrode, the reference electrode pattern, and the first electrode are formed of a printed wiring board, and
the resin substrate includes at least one of the epoxy resin, polyimide, and a liquid crystal polymer.

### Claim 18 (depends on 16)

The pressure sensor according to claim 16, wherein the conductive tape is a double-sided tape.

### Claim 19 (depends on 1)

The pressure sensor according to claim 1, further comprising a bonding material bonding the piezoelectric film to the first electrode,
wherein the bonding material has an elastic modulus of 10 MPa or more.

### Claim 20

Electronic equipment comprising:
a substrate having an elastic modulus of 1 MPa or less; and
a pressure sensor bonded to the substrate, the pressure sensor comprising:
a piezoelectric film having a first main surface and a second main surface;
a first electrode on the first main surface of the piezoelectric film; and
a second electrode on the second main surface of the piezoelectric film,
wherein
at least one of the first electrode and the second electrode is formed of a material having an elastic modulus of 60 GPa or more, and a product of a thickness of the least one of the first electrode and the second electrode in a stacking direction of the pressure sensor multiplied by the elastic modulus of the least one of the first electrode and the second electrode is 4 MPa*m or mroe.