Cleaning liquid composition
AssigneeKanto Kagaku Kabushiki Kaisha
InventorAreji Takanaka
Life of this patent
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Abstract
An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.
Claims7
A method for manufacturing a semiconductor substrate, comprising a step of bringing a cleaning liquid composition into contact with (a) the substrate having a Co contact plug and/or Co wiring or (b) the substrate having Co and not having Cu,
- wherein the cleaning liquid composition contains one or more reducing agents and water, and one or more polysulfonic acid compounds as a surfactant, and
- when the cleaning liquid composition is brought into contact with (b) the substrate having Co and not having Cu, a pH of the cleaning liquid composition is 3 or more and less than 12.
Dependencies are inferred from the claim text.