Memory devices and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Li Chiang, Jer-Fu Wang, Chao-Ching Cheng, Tzu-Chiang Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Li Chiang, Jer-Fu Wang, Chao-Ching Cheng, Tzu-Chiang Chen
Estimating the term…
A method of forming a memory device includes the following operations. A first conductive plug is formed within a first dielectric layer over a substrate. A treating process is performed to transform a portion of the first conductive plug into a buffer layer, and the buffer layer caps the remaining portion of the first conductive plug. A phase change layer and a top electrode are sequentially formed over the buffer layer. A second dielectric layer is formed to encapsulate the top electrode and the underlying phase change layer. A second conductive plug is formed within the second dielectric layer and in physical contact with the top electrode. A filamentary bottom electrode is formed within the buffer layer.
A memory device, comprising:
A memory device, comprising:
A memory device, comprising:
Dependencies are inferred from the claim text.