Back to results
US 11,903,316 B2Granted
Thermoelectric module
AssigneeKELK Ltd.
InventorsToshihiko Kishizawa, Shinichi Fujimoto, Manabu Ishii, Hideaki Yamagishi, Fumitaka Ueno
Life of this patent
Estimating the term…
Abstract
A thermoelectric module includesa plurality of electrodes (high temperature side electrodes and low temperature side electrodes, thermoelectric conversion elements (p-type element and n-type element) arranged between the two electrodes, and a bonding layer disposed between the electrodes and the thermoelectric conversion elements. The bonding layer includes copper-containing particles, copper balls each having a particle diameter of 30 μm or more, an intermetallic compound of copper and tin, and a fired resin.
Claims20
A thermoelectric module comprising:
- a plurality of electrodes;
- thermoelectric conversion elements arranged between the electrodes;
- and
- a bonding layer disposed between the electrodes and the thermoelectric conversion elements,
- wherein the bonding layer comprises:
- copper-containing particles having a volume-based cumulative 50% diameter (D50) that is 1 to 7 μm,
- copper balls having particle diameters of 30 μm or more, each of the particle diameters of the copper balls being greater than the D50 of the copper-containing particles,
- an intermetallic compound of copper and tin, the intermetallic compound surrounding the copper-containing particles and the copper balls, and
- a fired resin dispersed in a metal portion including the copper-containing particles and the intermetallic compound, and
- wherein a total area ratio of the intermetallic compound with respect to a cross-sectional area of the bonding layer is 10 to 30%.
7 more elements
Dependencies are inferred from the claim text.