Memory device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYumin Kim, Seyun Kim, Jinhong Kim, Soichiro Mizusaki, Youngjin Cho
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AssigneeSamsung Electronics Co., Ltd.
InventorsYumin Kim, Seyun Kim, Jinhong Kim, Soichiro Mizusaki, Youngjin Cho
Estimating the term…
A memory device may include an insulating structure including a first surface and a protrusion portion protruding from the first surface in a first direction, a recording material layer on the insulating structure and extending along a protruding surface of the protrusion portion to cover the protrusion portion and extending onto the first surface of the insulating structure, a channel layer on the recording material layer and extending along a surface of the recording material layer, a gate insulating layer on the channel layer; and a gate electrode formed on the gate insulating layer at a location facing a second surface of the insulating structure. The second surface of the insulating structure may be a protruding upper surface of the protrusion portion.
A method of manufacturing a memory device, the method comprising:
Dependencies are inferred from the claim text.