Power converter with integrated multi-layer cooling

A method of cooling a power converter, the method comprising:

• operating a power converter, wherein the power converter includes:
• a plurality of printed circuit boards (PCB) connected via a plurality of connector rods, the plurality of PCBs including a lower-most PCB and an upper-most PCB;
• a liquid cooling mechanism attached to the lower-most PCB;
• high-loss circuitry components attached to the lower-most PCB;
• low-loss circuitry components attached to one of the plurality of printed circuit boards, wherein the high-loss circuitry components have higher losses relative to the low-loss circuitry components;
• actively cooling the high-loss circuitry components via the liquid cooling mechanism;
• and
• passively cooling the low-loss circuitry components,
• wherein the power converter further includes magnetic components attached to the upper-most PCB.

A DC-DC power converter comprising:

• a first printed circuit board (PCB) and a second PCB, with the first PCB and the second PCB attached to one another and extending parallel and spaced apart from one another;
• a liquid cooling mechanism mounted to the first PCB;
• a plurality of circuitry components including high-loss circuitry components and low-loss circuitry components, wherein the high-loss circuitry components have higher losses relative to the low-loss circuitry components, wherein the high-loss circuitry components are attached to the first PCB;
• and
• a magnetic component attached to an upper surface of the second PCB, wherein the low-loss circuitry components are attached to a lower surface of the second PCB, and
• wherein the liquid cooling mechanism is operable to actively cool at least the high-loss circuitry components mounted to the first PCB, wherein the high-loss circuitry components are mounted to an opposite side of the first PCB relative to the liquid cooling mechanism.