System for modular liquid spray cooling of electronic devices

A method for cooling an electronic equipment comprising steps for:

• separating, with a divider, a heat exchanger section from a spray cooling section;
• spraying, with one or more sprayers a first liquid coolant effectively downward along one or more fins of one or more heat sinks in the spray cooling section;
• wherein said heat transferring means is positioned typically vertically so that said first liquid coolant at least one of, commonly flows downward and drained by gravity;
• collecting with a reservoir, the first liquid coolant sprayed along the one or more fins of the one or more heat sinks;
• suctioning, via a circulation pump into a pump suction port of the heat exchanger section, the collected liquid coolant in the reservoir;
• and
• pumping the coolant liquid collected from the reservoir into a heat exchanger device to re-cool the coolant liquid before being recirculated to the one or more sprayers.

A system comprising:

• a heat exchanger section;
• a spray cooling section;
• a divider, wherein said divider is operable for separating said heat exchanger section and said spray cooling section;
• one or more heat sinks for effectively transferring heat generated by an electronic equipment to at least one of a fluid medium and a liquid coolant;
• one or more fins disposed in said one or more heat sinks;
• at least one or more sprayers, said one or more sprayers being configured to spray the fluid medium or liquid coolant liquid effectively downward on said one or more fins of the one or more heat sinks in the spray cooling section;
• and
• a reservoir, wherein said reservoir is configured to collect said liquid coolant sprayed on said one or more heat sinks.