Method for manufacturing wiring board

A method for manufacturing a wiring board, the wiring board including an insulating substrate and a wiring layer disposed on a surface of the insulating substrate, and the wiring board having a predetermined wiring pattern, the method comprising:

• providing:
• an insulating substrate,
• an underlayer, which is electrically-conductive, disposed on a surface of the insulating substrate, wherein the underlayer includes an oxide film formed on a surface thereof, the providing the underlayer comprising vapor deposition of the oxide film, and
• a coating layer, which is electrically-conductive, disposed so as to coat the oxide film;
• forming a diffusion layer, in which an element forming the underlayer and an element forming the coating layer are mutually diffused, between the underlayer and a first portion of the coating layer, the forming the diffusion layer comprising irradiating the first portion of the coating layer corresponding to the predetermined wiring pattern with a laser beam;
• forming a seed layer from the first portion of the coating layer by removing a second portion of the coating layer, thereby leaving the first portion of the coating layer, disposed on the diffusion layer, as the seed layer;
• forming a metal layer on a surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode, pressing the solid electrolyte membrane against at least the seed layer, and applying a voltage between the anode and the underlayer, to thereby reduce metal ions contained in the solid electrolyte membrane;
• and
• forming the wiring layer by removing, from the insulating substrate, a portion of the underlayer not covered by the seed layer.