Fine feature formation techniques for printed circuit boards
AssigneeIntel Corporation
InventorsEric Li, Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang
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Abstract
Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process and forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure. Other embodiments are described and claimed.
Claims24
An apparatus, comprising:
- a low density interconnect (LDI) printed circuit board (PCB);
- and
- one or more fine conductive features disposed on the LDI PCB formed from a conductive feature, wherein the conductive feature comprising a fine gap region devoid of conductive material.
An apparatus, comprising:
- a low density interconnect (LDI) printed circuit board (PCB);
- and
- a plurality of fine conductive features disposed on the LDI PCB formed from a conductive feature, wherein the conductive feature comprising a fine gap region devoid of conductive material.
A system, comprising:
- a low density interconnect (LDI) printed circuit board (PCB) comprising:
- at least one substrate layer, and
- at least one conductive layer, the at least one conductive layer comprising one or more fine conductive features disposed on the LDI PCB formed from a conductive feature, wherein the conductive feature comprising a fine gap region devoid of conductive material;
- and
- a circuit device mounted to the PCB and coupled to the conductive layer.
Dependencies are inferred from the claim text.