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US 11,903,129 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
Life of this patent
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Abstract
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
Claims9
A printed circuit board comprising:
- a first insulating material;
- and
- a second insulating material disposed on one surface of the first insulating material in a stacking direction, and including first and second cavities having depths different from each other,
- wherein at least one groove portion is disposed in a side surface, and spaced apart in the stacking direction from a bottom surface, of each of the first and second cavities, and
- wherein the at least one groove portion includes an end portion covered by the second insulating material in a direction perpendicular to the stacking direction.
2 more elements
Dependencies are inferred from the claim text.