Radio frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorTadashi Nomura
Life of this patent
Estimating the term…
Abstract
An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.
Claims10
A radio frequency module comprising:
- a wiring board;
- a component on one principal surface of the wiring board;
- a sealing resin layer that has a contact surface being in contact with the one principal surface of the wiring board, an opposite surface opposite to the contact surface, and side surfaces connecting end edges of the contact surface with end edges of the opposite surface, and that seals the component;
- a mesh sheet on the opposite surface of the sealing resin layer, the mesh sheet comprising a plurality of linear members intersecting with one another in a mesh form;
- and
- a shield film that covers at least the side surfaces of the sealing resin layer and the mesh sheet on the opposite surface of the sealing resin layer,
- wherein an embedded portion of the mesh sheet is embedded in the sealing resin layer in a thickness direction of the mesh sheet,
- wherein an exposed portion of the plurality of linear members of the mesh sheet is exposed from the opposite surface of the sealing resin layer, and
- wherein the exposed portion contacts the shield film.
Dependencies are inferred from the claim text.