Flexible circuit board and chip package having a chip mounting region

A chip package comprising:

• a substrate including a first surface and a second surface opposite to the first surface and the substrate including a chip mounting region;
• a circuit pattern layer disposed on the first surface;
• a chip electrically connected to the circuit pattern layer;
• and
• a heat dissipation part disposed on the chip mounting region,
• wherein the substrate is formed with at least two or more holes that are provided in a region overlapping the heat dissipation part, and
• the heat dissipation part includes:
• a heat dissipation pattern layer disposed on the first surface;
• a connection layer disposed inside the hole;
• and
• a heat dissipation layer disposed on the second surface,
• wherein the heat dissipation pattern layer, the connection layer, and the heat dissipation layer are integrally formed,
• wherein a first direction corresponds to a longitudinal direction of a chip disposed on the chip mounting region, and a second direction corresponds to a width direction of the chip disposed on the chip mounting region,
• wherein a first separation distance is a spaced apart distance in the first direction of two of the holes, a second separation distance is a spaced apart distance in the second direction of two of the holes, and the first separation distance is smaller than the second separation distance,
• wherein a third separation distance is a minimum separation distance in the second direction of the heat dissipation pattern layer and the circuit pattern layer, and the third separation distance is greater than the second separation distance,
• wherein the circuit pattern layer has a plurality of circuit patterns,
• wherein a fourth separation distance is a minimum separation distance between two adjacent circuit patterns of the plurality of circuit patterns, and the fourth separation distance is smaller than the first separation distance.