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US 11,903,118 B2Granted
Cooling of ultrasound energizers mounted on printed circuit boards
AssigneeSofwave Medical Ltd.
InventorsAriel Sverdlik, Erez Panir
Life of this patent
Estimating the term…
Abstract
An assembly including: a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted on the first surface; at least one cooling element associated with the PCB second surface, wherein the cooling element is configured to cool the at least one energy transmitter via the PCB.
Claims25
An energy transmitting assembly unit, comprising:
- a plurality of ultrasound transducers;
- a thin circuit board having a first surface and a second surface and a thickness up to 3 mm, wherein said plurality of ultrasound transducers are mounted on said first surface;
- wherein said thin circuit board comprises:
- electrical wiring in or on said thin circuit board coupled to each of said plurality of ultrasound transducers;
- a plurality of heat conducting regions in said thin circuit board positioned between said first surface and said second surface, wherein each of said plurality of heat conducting regions is aligned with at least one ultrasound transducer of said plurality of ultrasound transducers mounted on said first surface and is positioned to selectively increase heat conductivity from said at least one ultrasound transducer through the thin circuit board;
- wherein said plurality of heat conducting regions and/or said second surface are configured to be coupled to a cooling element,
- where each of said plurality of heat conducting regions comprises a cavity crossing through said second surface and said first surface towards a conductor supplying electricity to at least one ultrasound transducer of said a plurality of ultrasound transducers, wherein said cavity is filled at least partly with a heat conducting material.
4 more elements
A method for manufacturing of an energy transmitting assembly unit, comprising:
- providing a thin rigid circuit board having electrical wiring, a first surface and a second surface, and a thickness in a range between 0.5 and 3 mm, wherein said first surface comprises predetermined locations for positioning of ultrasound transducers;
- mounting at least two ultrasound transducers at said predetermined locations on said first surface, and at a distance from each other, wherein said mounting comprises mounting said at least two ultrasound transducers on said first surface using a pick and place process, at a distance in a range between 0.5 and 20 mm therebetween, placing an electrically conducting pad at each of said predetermined locations on said first surface, wherein said electrically conducting pad is attached to said first surface by an electrically conducting adhesive, and wherein said mounting comprises mounting ultrasound transducers of said at least two ultrasound transducers on said electrically conducting pad.
Dependencies are inferred from the claim text.