Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates

An imaging device comprising:

• a first structure;
• and a second structure, wherein the first structure includes
• a first substrate,
• a temperature detection element provided on the first substrate and configured to detect a temperature on a basis of an infrared ray, and
• a signal line and a drive line connected to the temperature detection element, and
• the second structure includes
• a second substrate, and
• a drive circuit provided on the second substrate and covered with a covering layer, wherein
• the first substrate and the second substrate are stacked,
• the signal line is electrically connected with the drive circuit via a signal line connection portion,
• the drive line is electrically connected with the drive circuit via a drive line connection portion,
• the signal line connection portion includes a first signal line connection portion formed in the first structure and a second signal line connection portion formed in the second structure,
• the drive line connection portion includes a first drive line connection portion formed in the first structure and a second drive line connection portion formed in the second structure,
• the first signal line connection portion includes a first A connection hole formed in the first structure,
• the second signal line connection portion includes a first B connection hole formed in the second structure,
• the first drive line connection portion includes a second A connection hole formed in the first structure,
• the second drive line connection portion includes a second B connection hole formed in the second structure,
• the first A connection hole and the first B connection hole are integrally connected to configure a first connection hole,
• the second A connection hole and the second B connection hole are integrally connected to configure a second connection hole, wherein
• the first connection hole includes a first core portion and a first outer peripheral portion disposed between a sidewall of the first connection hole and the first core portion,
• the second connection hole includes a second core portion including a same material as a material that configures the first core portion, and a second outer peripheral portion disposed between a sidewall of the second connection hole and the second core portion, and including a same material as a material that configures the first outer peripheral portion, and
• the first outer peripheral portion is thinner than the second outer peripheral portion.