Position sensor and hybrid substrate for camera focus management

An apparatus comprising:

• a housing;
• a substrate disposed at a first position within the housing and including a surface defining a plane;
• an integrated circuit package disposed within the housing and on the surface of the substrate, wherein the integrated circuit package is electrically connected to the substrate;
• a printed circuit board (PCB) disposed at a second position within the housing and comprising one or more connectors accessible outside the housing;
• and
• a flexible PCB connector electrically connecting the substrate to the PCB such that electrical signals from the integrated circuit package are accessible outside the housing by way of the one or more connectors;
• and
• one or more electrical components disposed on the PCB and configured to process the electrical signals from the integrated circuit package before the electrical signals reach the one or more connectors.

An apparatus comprising:

• a housing;
• a substrate disposed at a first position within the housing and including a surface defining a plane;
• an integrated circuit package disposed within the housing and on the surface of the substrate, wherein the integrated circuit package is electrically connected to the substrate;
• a thermal interface material disposed between the substrate and a portion of the housing and configured to dissipate heat from the integrated circuit package to the housing by way of the substrate and the thermal interface material;
• a printed circuit board (PCB) disposed at a second position within the housing and comprising one or more connectors accessible outside the housing;
• and
• a flexible PCB connector electrically connecting the substrate to the PCB such that electrical signals from the integrated circuit package are accessible outside the housing by way of the one or more connectors.

An apparatus comprising:

• a housing;
• a substrate disposed at a first position within the housing and including a surface defining a plane, wherein the substrate has a first coefficient of thermal expansion (CTE);
• an integrated circuit package disposed within the housing and on the surface of the substrate, wherein the integrated circuit package is electrically connected to the substrate;
• a printed circuit board (PCB) disposed at a second position within the housing and comprising one or more connectors accessible outside the housing, wherein the PCB has a second CTE, wherein the integrated circuit package has a third CTE, and wherein a difference between the first CTE and the third CTE is smaller than a difference between the second CTE and the third CTE;
• and
• a flexible PCB connector electrically connecting the substrate to the PCB such that electrical signals from the integrated circuit package are accessible outside the housing by way of the one or more connectors.

An apparatus comprising:

• a housing;
• a substrate disposed at a first position within the housing and including a surface defining a plane;
• an integrated circuit package disposed within the housing and on the surface of the substrate, wherein the integrated circuit package is electrically connected to the substrate;
• a printed circuit board (PCB) disposed at a second position within the housing and comprising one or more connectors accessible outside the housing;
• a flexible PCB connector electrically connecting the substrate to the PCB such that electrical signals from the integrated circuit package are accessible outside the housing by way of the one or more connectors;
• a lens;
• and
• a lens holder configured to retain the lens at a fixed position relative to the housing such that an optical axis defined by the lens is substantially perpendicular to the plane defined by the surface of the substrate.