Camera module and manufacturing method therefor, and terminal
AssigneeKunshan QTech Microelectronics Co., Ltd.
InventorsAiguo Deng, Yangliu Xu, Yuanbin Jin, Huanhuan Yan
Life of this patent
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Abstract
Disclosed are a camera module and a method thereof, and a terminal which relates to the field of camera technology. The camera comprises a circuit board, a sensitive chip, a bracket, and a sealing member. At least one side of the bracket is an open side, and a receiving cavity is defined between a surface of the open side facing the circuit board and a first surface of the circuit board. The sealing member is filled in the receiving cavity. The camera module improves the space utilization efficiency, reduces the width of the open side, increases the screen-to-body ratio of the terminal, and improves user's perception and user experience.
Claims20
A camera module, comprising:
- a circuit board, the circuit board comprising a first end and a second end parallel to and opposite to the first end in a first horizontal direction, the circuit board comprising a first surface and a second surface facing away from the first surface in a vertical direction;
- a sensitive chip, disposed on the first surface of the circuit board, the sensitive chip comprising a sensitive area and a non-sensitive area surrounding the sensitive area;
- a bracket, disposed on the first surface of the circuit board and surrounding the sensitive chip, the bracket comprising a plurality of sides, wherein at least one side of the bracket is an open side, and a receiving cavity is defined between a surface of the open side facing the circuit board and the first surface of the circuit board;
- and
- a sealing member, filled in the receiving cavity.
A method of manufacturing camera module, comprising the following steps:
- providing a mother board, the mother hoard comprising a plurality of circuit boards, in a first horizontal direction, each circuit board comprising a first end and a second end parallel to and opposite to the first end;
- positioning a sensitive chip on a corresponding position of each circuit board;
- assembling a bracket surrounding the periphery of the sensitive chip of each circuit board correspondingly, at least one side of the bracket being configured as an open side, and a receiving cavity being defined between the surface of the open side facing the circuit board and the first surface facing the open side;
- forming a sealing member, the sealing member filled in the receiving cavity;
- and
- performing a cutting process to form a semi-finished product of separated camera modules.
Dependencies are inferred from the claim text.