Method and apparatus for providing field-programmable gate array (FPGA) integrated circuit (IC) package

A method of managing a plurality of field-programmable gate array (“FPGA”) dies in a package, comprising:

• programming at least a portion of first field-programmable gate array (“FPGA”) die situated on a substrate to perform a first FPGA design partition in accordance with configuration data based on user input;
• programming at least a portion of second FPGA die situated on the substrate to perform a second FPGA design partition in accordance with the configuration data;
• and
• coupling an input output (“TO”) serializer of the first FIGA die to an IO deserializer of the second FPGA die for providing inter-die communication.

An integrated circuit (“IC”) module able to be selectively configured to perform one or more user defined logic functions, the module comprising:

• a substrate able to house multiple IC chips for facilitating transmission of signals between the IC chips;
• a plurality of field-programmable gate array (“FPGA”) dies placed on the substrate functioning as a single FPGA entity, wherein one of the plurality of FPGA dies is designated to be a master FPGA die for managing at least a portion of the plurality of FPGA dies as slave FPGA dies;
• and
• a regulator coupled to the plurality of FPGA dies and configured to facilitate multiple power domains to the slave FPGA dies in accordance with signals from the master FPGA die.