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US 11,901,694 B2Granted
Package structure
AssigneeiReach Corporation
InventorsHsiu-Ju Yang, Shou-Lung Chen, Hsin-Chan Chung
Life of this patent
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Abstract
A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.
Claims7
A package structure comprising:
- a substrate comprising a first surface;
- a semiconductor chip disposed on the first surface;
- a glue layer disposed on the first surface and directly connecting the side surface of the semiconductor chip, wherein the glue layer comprises at least one electrical conducting layer through into the glue layer and electrically connected to the substrate,
- a support disposed on the glue layer, wherein the support comprises an electrical conducting member penetrating the support electrically connected to the electrical conducting layer of the glue layer;
- and
- an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member and the electrical conducting layer.
3 more elements
A package structure comprising:
- a substrate comprising a first surface;
- a semiconductor chip disposed on the first surface;
- a support disposed on the first surface and surrounding the semiconductor chip, wherein the support comprises an electrical conducting member penetrating the support;
- and
- an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member;
- wherein the optical component comprises a glass layer, a conducting layer disposed on the glass layer, and a patterned encapsulant layer disposed on the glass layer and covering a portion of the conducting layer;
- wherein the conducting layer comprises a first conducting portion and a second conducting portion which are not electrically connected but are respectively disposed on two opposing edges of the peripheral area from the top view of the package structure.
4 more elements
A package structure comprising:
- a semiconductor chip comprising a first surface, a second surface opposing to the first surface, a side surface between the first surface and the second surface, a first conducting structure and a second conducting structure, wherein the first conducting structure and the second conducting structure are located on the first surface of the semiconductor chip;
- a glue layer surrounding and directly connecting the side surface of the semiconductor chip;
- a spacer disposed on the glue layer and surrounding the semiconductor chip;
- and
- an optical component disposed on the spacer,
- wherein the optical component comprises a glass layer, a conducting layer disposed on the glass layer, and a patterned encapsulant layer disposed on the glass layer and covering a portion of the conducting layer, wherein at least part of the conducting layer disposed in the central area of the glass layer.
3 more elements
Dependencies are inferred from the claim text.