Terminal material for connectors
AssigneeMitsubishi Materials Corporation
InventorsYoshie Tarutani, Kenji Kubota
Life of this patent
Estimating the term…
Abstract
Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 μm to 20 μm inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.
Claims18
A terminal material for connectors comprising
- a base material wherein at least a surface layer is made of copper or copper alloy;
- a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material;
- and
- a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, having a film thickness 0.5 μm or more and 20.0 μm or less, a nickel content 0.03 at % or more and 1.20 at % or less, and an average crystal grain size 10 nm or more and 150 nm or less.
Dependencies are inferred from the claim text.