Chip-package-antenna integrated structure based on substrate integrated waveguide (SIW) multi-feed network

Abstract

A chip-package-antenna integrated structure based on an SIW multi-feed network. A plurality of output terminals of the chip are connected to the SIW multi-feed network through the impedance matching network, to achieve the impedance matching between the chip and the SIW multi-feed network. The output terminal of the SIW multi-feed network is directly connected to the antenna terminals, and two or more input signals experience power combining in the substrate integrated waveguide are combined for power combining. Then the combined millimeter-wave signal is radiated by the antenna, finally realizing the power combining in the chip-package-antenna integrated structure. At the same time, the SIW multi-feed network is composed of a SIW structure, in which a plurality of via holes are arranged spaced apart to form a cavity structure.

Dependencies are inferred from the claim text.