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AssigneeBoe Technology Group Co., Ltd.
InventorsLiang Chen, Lei Wang, Minghua Xuan, Dongni Liu, Li Xiao, Detao Zhao, Hao Chen
Estimating the term…
Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.
A method for transferring a chip, comprising:
A chip, comprising:
A target substrate, comprising:
Dependencies are inferred from the claim text.