Methods for fabricating thin film III-V compound solar cell
AssigneeMicroLink Devices, Inc.
InventorsNoren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
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AssigneeMicroLink Devices, Inc.
InventorsNoren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
Estimating the term…
The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
A plurality of thin film multi-junction solar cells free of a six inch substrate on which the plurality of solar cells were formed, each comprising:
A plurality of thin film multi-junction solar cells free of a six inch GaAs substrate on which the plurality of solar cells were formed, each comprising:
Dependencies are inferred from the claim text.