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US 11,901,399 B2Granted
Enhanced sensing coil for semiconductor device
AssigneeRealtek Semiconductor Corp.
InventorsHsiao-Tsung Yen, Ka-Un Chan
Life of this patent
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Abstract
A semiconductor device includes a first coil, a second coil, and a third coil. The second coil is disposed with respect to the first coil. The third coil is configured to sense a signal on the first coil. A first overlapped area, on a projection plane, of the third coil and the first coil is larger than a second overlapped area, on the projection plane, of the third coil and the second coil.
Claims17
A semiconductor device, comprising:
- a first coil;
- a second coil disposed with respect to the first coil;
- and
- a third coil configured to sense a signal on the first coil, wherein a first overlapped area, on a projection plane, of the third coil and the first coil is larger than a second overlapped area, on the projection plane, of the third coil and the second coil, wherein the third coil comprises:
- a first trace;
- a second trace;
- a third trace coupled between the first trace and the second trace;
- a fourth trace;
- a fifth trace;
- a sixth trace coupled between the fourth trace and the fifth trace;
- and
- a seventh trace coupled the first trace and the fourth trace, wherein the first trace, the second trace, the third trace, the fourth trace, the fifth trace, and the sixth trace are disposed at a first metal layer, wherein the seventh trace is disposed at a second metal layer.
9 more elements
A semiconductor device, comprising:
- a first coil;
- a second coil disposed with respect to the first coil;
- and
- a third coil configured to sense a signal on the first coil, wherein a first capacitor value between the third coil and the first coil is larger than a second capacitor value between the third coil and the second coil,
- wherein the third coil surrounds the first coil and the second coil;
- wherein the third coil comprises a main trace and a protrusion portion, the protrusion portion is connected to the main trace, and the protrusion portion and the first coil are overlapped on a projection plane.
3 more elements
Dependencies are inferred from the claim text.