LED chip having fan-out structure and manufacturing method of the same

A light emitting apparatus, comprising:

• a first LED sub-unit;
• a second LED sub-unit disposed on the first LED sub-unit;
• a third LED sub-unit disposed on the second LED sub-unit;
• a plurality of connection electrodes electrically connected to at least one of the first, second, and third LED sub-units, the connection electrodes covering a side surface of at least one of the first, second, and third LED sub-units;
• a first passivation layer surrounding side surfaces of at least one of the first, second, and third LED sub-units and including a region having a thickness greater than a thickness of each of the connection electrodes;
• an insulating layer having first and second opposed surfaces, with the first surface facing the LED sub-units;
• and
• a first electrode disposed on the first surface of the insulating layer and electrically connected to at least one of the connection electrodes,
• wherein a thickness of the first LED sub-unit is greater than that of the second LED sub-unit,
• wherein the thickness of the first LED sub-unit is greater than that of the third LED sub-unit, and
• wherein each of the first, second, and third LED sub-units is configured to be driven independently to emit light having different intensities.