Imaging device
AssigneeSony Semiconductor Solutions Corporation
InventorsTakeyoshi Komoto, Masahiko Nakamizo, Toshiaki Ono, Tomonori Yamashita
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AssigneeSony Semiconductor Solutions Corporation
InventorsTakeyoshi Komoto, Masahiko Nakamizo, Toshiaki Ono, Tomonori Yamashita
Estimating the term…
An imaging device of an embodiment has a first substrate, a second substrate, a wire, and a trench. The first substrate has a pixel having a photodiode and a floating diffusion that holds a charge converted by the photodiode. The second substrate has a pixel circuit that reads a pixel signal based on the charge held in the floating diffusion in the pixel, and is stacked on the first substrate. The wire penetrates the first substrate and the second substrate in a stacking direction, and electrically connects the floating diffusion in the first substrate to an amplification transistor in the pixel circuit of the second substrate. The trench is formed at least in the second substrate, runs in parallel with the wire, and has a depth equal to or greater than the thickness of a semiconductor layer in the second substrate.
An imaging device, comprising:
An imaging device, comprising:
An imaging device, comprising:
An imaging device, comprising:
Dependencies are inferred from the claim text.