Semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chien Ku, Huai-Jen Tung, Keng-Ying Liao, Yi-Hung Chen, Shih-Hsun Hsu, Yi-Fang Yang
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Abstract
A semiconductor device includes a substrate, a dielectric layer, a plurality of dielectric patterns and a conductive pad. The substrate includes a first surface and a second surface opposite to the first surface. The dielectric layer is disposed at the first surface of the substrate, and the substrate is disposed between the dielectric layer and the second surface of the substrate. The dielectric patterns are disposed on the dielectric layer and between the first surface and the second surface of the substrate. The conductive pad is inserted between the plurality of dielectric patterns and extended into the dielectric layer.
Claims20
A semiconductor device, comprising:
- a substrate comprising a first surface and a second surface opposite to the first surface;
- a dielectric layer at the first surface of the substrate, the substrate being disposed between the dielectric layer and the second surface of the substrate;
- a plurality of dielectric patterns on the dielectric layer and between the first surface and the second surface of the substrate;
- and
- a conductive pad, inserted between the plurality of dielectric patterns and extended into the dielectric layer, wherein the plurality of dielectric patterns are separated from the substrate by a lateral distance.
A semiconductor device, comprising:
- a semiconductor substrate comprising a first portion and a second portion;
- a single-layered dielectric layer below the semiconductor substrate;
- a conductive line and a conductive via in the single-layered dielectric layer, wherein the conductive via is disposed between the semiconductor substrate and the conductive line;
- and
- a conductive pad, wherein the conductive pad is disposed between the first portion and the second portion of the semiconductor substrate and extended into the single-layered dielectric layer to electrically connected to the conductive line.
A semiconductor device, comprising:
- a semiconductor substrate;
- an interconnection structure at a first side of the semiconductor substrate;
- a bonding pad, surrounded by the semiconductor substrate and electrically connected to the interconnection structure;
- and
- an electrically floating conductor, surrounding the bonding pad and disposed between the bonding pad and the semiconductor substrate, wherein the electrically floating conductor is electrically isolated from the bonding pad.
Dependencies are inferred from the claim text.