Semiconductor package and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorByoungrim Seo
Life of this patent
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Abstract
A semiconductor package includes a semiconductor chip structure that includes an image sensor chip and a logic chip that contact each other, a transparent substrate disposed on the semiconductor chip structure, and an adhesive structure disposed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate. The adhesive structure includes a first adhesive segment disposed on a top surface of the semiconductor chip structure and a second adhesive segment disposed on a bottom surface of the transparent substrate. The second adhesive segment covers top and lateral surfaces of the first adhesive segment. The image sensor chip is closer to the transparent substrate than the logic chip.
Claims17
A semiconductor package, comprising:
- a semiconductor chip structure that includes an image sensor chip and a logic chip that contact each other;
- a transparent substrate disposed on the semiconductor chip structure;
- and
- an adhesive structure disposed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate,
- wherein the adhesive structure includes:
- a first adhesive segment disposed on a top surface of the semiconductor chip structure;
- and
- a second adhesive segment disposed on a bottom surface of the transparent substrate,
- wherein the second adhesive segment covers top and lateral surfaces of the first adhesive segment,
- wherein the image sensor chip is closer to the transparent substrate than the logic chip, and
- wherein the second adhesive segment is in contact with the top surface of the semiconductor chip structure along the lateral surfaces of the first adhesive segment.
A semiconductor package, comprising:
- a substrate;
- a logic chip disposed on the substrate;
- an image sensor chip disposed on the logic chip, wherein the image sensor chip includes a microlens array on a top surface of the image senor chip;
- a transparent substrate disposed on the image sensor chip;
- and
- an adhesive structure disposed between the image sensor chip and the transparent substrate, wherein the adhesive structure surrounds the microlens array,
- wherein the adhesive structure includes:
- a first adhesive segment disposed on the top surface of the image sensor chip;
- a second adhesive segment disposed on the top surface of the image sensor chip, wherein when viewed in a plan view, the second adhesive segment surrounds the first adhesive segment;
- and
- a third adhesive segment disposed on a bottom surface of the transparent substrate, wherein the third adhesive segment covers the first and second adhesive segments from top sides of the first and second adhesive segments,
- wherein the first and second adhesive segments include a photo-curable polymer,
- wherein the third adhesive segment includes a thermo-curable polymer, and the third adhesive segment covers top and lateral surfaces of the first adhesive segment and top and lateral surfaces of the second adhesive segment.
A method of fabricating a semiconductor package, the method comprising:
- providing a semiconductor chip structure that includes an image sensor chip and a logic chip that contact each other, wherein the image sensor chip includes a microlens array on a top surface of the image sensor chip;
- forming a first adhesive segment on a top surface of the semiconductor chip structure, wherein the first adhesive segment surrounds the microlens array;
- irradiating the first adhesive segment with light wherein the first adhesive segment is cured;
- forming a second adhesive segment on a transparent substrate;
- placing the transparent substrate on the semiconductor chip structure wherein the second adhesive segment comes into contact with the first adhesive segment;
- and
- heating the second adhesive segment wherein the second adhesive segment is cured,
- wherein, when the transparent substrate is placed on the semiconductor chip structure, the first adhesive segment is inserted into the second adhesive segment, and the second adhesive segment is in contact with the top surface of the semiconductor chip structure.
Dependencies are inferred from the claim text.