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US 11,901,384 B2Granted
CMOS image sensor package
AssigneeSamsung Electronics Co., Ltd.
InventorKyoungsoon Cho
Life of this patent
Estimating the term…
Abstract
A CMOS image sensor (CIS) package includes a package substrate, a CIS chip arranged on an upper surface of the package substrate and electrically connected with the package substrate, a glass arranged over the CIS chip, and an adhesive layer interposed between an edge portion of an upper surface of the CIS chip and an edge portion of a lower surface of the glass to attach the glass to the CIS chip. An interlocking recess is provided to at least one of the CIS chip and the glass, and the adhesive layer comprises an interlocking protrusion inserted into the interlocking recess.
Claims21
A CMOS image sensor (CIS) package comprising:
- a package substrate;
- a CIS chip arranged on an upper surface of the package substrate and electrically connected with the package substrate, the CIS chip including a first interlocking recess formed along an edge portion of an upper surface of the CIS chip;
- a glass arranged over the CIS chip, the glass including a second interlocking recess formed along an edge portion of a lower surface of the glass;
- an adhesive layer interposed between the edge portion of the upper surface of the CIS chip and the edge portion of the lower surface of the glass to attach the glass to the CIS chip, the adhesive layer including a first interlocking protrusion inserted into the first interlocking recess and a second interlocking protrusion inserted into the second interlocking recess;
- and
- a molding member formed on the upper surface of the package substrate to support the CIS chip and the glass,
- wherein the adhesive layer has an outer side surface positioned inside an outer side surface of the glass, and the outer side surface of the adhesive layer does not protrude from the outer side surface of the glass,
- wherein each of the first and second interlocking recesses has a width of from about 2/15 times to about 3/15 times a width of the adhesion layer, and
- wherein the width of each of the first and second interlocking recesses and the width of the adhesion layer are measured in the same horizontal direction.
6 more elements
A CMOS image sensor (CIS) package comprising:
- a package substrate;
- a CIS chip arranged on an upper surface of the package substrate and electrically connected with the package substrate, the CIS chip including a first interlocking recess formed along an edge portion of an upper surface of the CIS chip;
- a glass arranged over the CIS chip, the glass including a second interlocking recess formed along an edge portion of a lower surface of the glass;
- an adhesive layer interposed between the edge portion of the upper surface of the CIS chip and the edge portion of the lower surface of the glass to attach the glass to the CIS chip, the adhesive layer including a first interlocking protrusion inserted into the first interlocking recess and a second interlocking protrusion inserted into the second interlocking recess;
- and
- a molding member formed on the upper surface of the package substrate to support the CIS chip and the glass,
- wherein the adhesive layer has an outer side surface positioned inside an outer side surface of the glass, and the outer side surface of the adhesive layer does not protrude from the outer side surface of the glass.
4 more elements
A CMOS image sensor (CIS) package comprising:
- a package substrate;
- a CIS chip arranged on an upper surface of the package substrate and electrically connected with the package substrate;
- a glass arranged over the CIS chip;
- and
- an adhesive layer interposed between an edge portion of an upper surface of the CIS chip and an edge portion of a lower surface of the glass to attach the glass to the CIS chip,
- wherein an interlocking recess is provided to at least one of the CIS chip and the glass, and the adhesive layer comprises an interlocking protrusion inserted into the interlocking recess,
- wherein the adhesive layer has an outer side surface positioned inside an outer side surface of the glass, and the outer side surface of the adhesive layer does not protrude from the outer side surface of the glass.
4 more elements
Dependencies are inferred from the claim text.