Semiconductor package including a fillet layer
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Sick Park, Min Soo Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a base substrate having a first semiconductor substrate, and a first protective layer covering a top side thereof. A first semiconductor chip is on the first protective layer. A first fillet layer fills a space between the first protective layer and the first semiconductor chip. A first side surface of the base substrate extends in a first direction, and second and third side surfaces extend in a second direction. The base substrate includes two corner regions and a side region between the corner regions. A first protective layer in the side region includes a first side trench which overlaps the first semiconductor chip. A part of the first fillet layer fills the first side trench.
Claims19
A semiconductor package, comprising:
- a base substrate including a first semiconductor substrate and a first protective layer at least partially covering a top surface of the first semiconductor substrate;
- a first semiconductor chip disposed on the first protective layer;
- a first fillet layer at least partially filling a space between the first protective layer and the first semiconductor chip;
- and
- a molding contacting the base substrate and enclosing the first semiconductor chip and the first fillet layer, wherein the first semiconductor chip and the first fillet layer are disposed between the molding and the base substrate in a direction perpendicular to an upper surface of the first semiconductor substrate,
- wherein the first protective layer includes a first trench extending partially through a thickness of the first protective layer and totally overlapping the first semiconductor chip such that a bottom surface of the first protective layer and the top surface of the first semiconductor substrate are planar, and
- wherein a part of the first fillet layer directly contacts the first protective layer and at least partially fills the first trench.
A semiconductor package, comprising:
- a base substrate including a first semiconductor substrate and a first protective layer at least partially covering a top surface of the first semiconductor substrate;
- a first semiconductor chip disposed on the first protective layer;
- a first fillet layer at least partially filling a space between the first protective layer and the first semiconductor chip;
- and
- a molding contacting the base substrate and enclosing the first semiconductor chip and the first fillet layer, wherein the first semiconductor chip and the first fillet layer are disposed between the molding and the base substrate in a direction perpendicular to an upper surface of the first semiconductor substrate,
- wherein the first protective layer includes a first trench recessed from a top surface of the first protective layer and totally overlapping the first semiconductor chip such that a bottom surface of the first protective layer extends along the top surface of the first semiconductor substrate,
- wherein the bottom surface of the first protective layer is planar over its entirety;
- and
- wherein a part of the first fillet layer directly contacts the first protective layer and at least partially fills the first trench.
Dependencies are inferred from the claim text.