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US 11,901,332 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsYeong Beom Ko, Jin Han Kim, Dong Jin Kim, Do Hyung Kim, Glenn Rinne
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Abstract
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.
Claims20
A method of manufacturing a semiconductor package, the method comprising:
- receiving a first structure comprising:
- a temporary part;
- and
- an interposer on the temporary part, wherein the interposer comprises an interposer first side facing away from the temporary part and an interposer second side facing toward and coupled to the temporary part;
- providing a package contact structure on the interposer first side, the package contact structure comprising a first side configured for coupling the semiconductor package to another component and a second side coupled to the interposer first side;
- forming a first encapsulation layer on the interposer first side, wherein the first encapsulation layer comprises a first encapsulation layer first side facing away from the interposer first side, a first encapsulation layer second side facing toward the interposer first side, and a first encapsulation layer lateral side between the first encapsulation layer first side and the first encapsulation layer second side;
- and
- after said forming the package contact structure and after said forming the first encapsulation layer, removing the temporary part,
- wherein a first encapsulation material of the first encapsulation layer laterally surrounds the package contact structure and covers the interposer first side;
- and
- wherein the first side of the package contact structure protrudes beyond the first encapsulation layer first side.
8 more elements
A semiconductor package comprising:
- an interposer comprising an interposer first side, an interposer second side opposite the interposer first side;
- and an interposer lateral side that extends between the interposer first side and the interposer second side;
- a package contact structure on the interposer first side, the package contact structure comprising a first side configured for coupling the semiconductor package to another component and a second side coupled to the interposer first side;
- a first encapsulation layer on the first interposer side, wherein the first encapsulation layer comprises a first encapsulation layer first side facing away from the interposer first side, a first encapsulation layer second side facing toward the interposer first side, and a first encapsulation layer lateral side between the first encapsulation layer first side and the first encapsulation layer second side, wherein a first encapsulation material of the first encapsulation layer laterally surrounds the package contact structure and covers the interposer first side;
- a semiconductor die on the second interposer side;
- and
- a second encapsulation layer on the second interposer side, wherein a second encapsulation material of the second encapsulation layer laterally surrounds the semiconductor die and covers the interposer second side;
- and
- wherein the first side of the package contact structure protrudes beyond the first encapsulation layer first side.
6 more elements
Dependencies are inferred from the claim text.