Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorKenshi Terashima
Life of this patent
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Abstract
A semiconductor device includes a first semiconductor chip including an output electrode portion on a front surface thereof, the output electrode portion including a plurality of electrode regions, each of which is provided at a respective position of the output electrode portion, and a plurality of wires, each electrode region being connected to a different one or more wires among the plurality of wires, through which a respective amount of output current is output. A total number of the different one or more wires connected to each electrode region is set depending on the respective position of the electrode region of the output electrode portion, so that the electrode region has a respective current amount per wire that is equal to or less than a respective predetermined value.
Claims14
A semiconductor device, comprising:
- a first semiconductor chip including an output electrode portion on a front surface thereof, the output electrode portion including a plurality of electrode regions, each of which is provided at a respective position of the output electrode portion;
- and
- a plurality of wires, each electrode region being connected to a different one or more wires among the plurality of wires, through which a respective amount of output current is output, wherein
- a respective total number of the different one or more wires connected to each electrode region is set depending on the respective position of said each electrode region, so that a respective current amount of each of the different one or more wires connected to said each electrode region is equal to or less than a respective predetermined value associated with said each electrode region,
- wherein the front surface of the first semiconductor chip has a rectangular shape having four edge portions in a plan view and further includes a control electrode portion that receives a control voltage, the control electrode portion being provided at one of the four edge portions of the front surface of the first semiconductor chip,
- wherein the plurality of electrode regions are arranged in an extension direction from the control electrode portion to an other one of the four edge portions facing the one of the four edge portions in which the control electrode portion is provided,
- wherein the plurality of electrode regions each have a respective separation distance from the control electrode portion in the extension direction, and include a nearest electrode region that has a first separation distance, a farthest electrode region that has a second separation distance, and an intermediate electrode region that has a third separation distance, the first separation distance being smaller than the second and third separation distances, the second separation distance being greater than the third separation distance, and
- wherein the respective predetermined value associated with each electrode region differs depending on the respective separation distance of said each electrode region.
Dependencies are inferred from the claim text.