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US 11,901,327 B2Granted
Wire bonding for semiconductor devices
AssigneeWestern Digital Technologies, Inc.
InventorsYang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian, Junrong Yan
Life of this patent
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Abstract
A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.
Claims11
A semiconductor device comprising:
- an integrated circuit die having a plurality of bond pads;
- and
- a plurality of bond wires, each of the plurality of bond wires being physically connected to a respective one of the plurality of bond pads by a ball bond,
- wherein a footprint of each ball bond in an area of contact between each ball bond and the respective bond pad has a shape that is non-circular and includes a first axis of symmetry,
- wherein the footprint of each ball bond includes a ball bond width and a ball bond length, and
- wherein each of the bond pads includes a bond pad width and a bond pad length, and wherein a ratio of the ball bond length to the ball bond width is equal to a ratio of the bond pad length to the bond pad width ±10%.
3 more elements
Dependencies are inferred from the claim text.