Chip package method and chip package structure

A chip package structure, comprising:

• a chip, the chip including metal pins;
• an organic polymer material layer, the organic polymer material layer being located on a side of the metal pins away from the chip, the organic polymer material layer including a first via hole, and the organic polymer material layer including a first surface away from the chip;
• metal parts, at least a first portion of the metal parts being located in the first via hole, the metal parts and metal pins being electrically connected, the metal parts including a second surface away from the chip, and the second surface and the first surface being flush to each other;
• an encapsulating layer, the encapsulating layer being located on a side of the metal parts away from the organic polymer material layer;
• and
• an alignment part, wherein an orthographic projection of the chip on the organic polymer material layer borders on an orthographic projection of the alignment part on the organic polymer material layer.