Semiconductor packages having conductive pillars with inclined surfaces

A semiconductor package, comprising:

• a first device comprising a plurality of conductive pillars, wherein surfaces of the conductive pillars respectively have planar portions and inclined portions physically connected to the planar portions, the planar portions are respectively disposed at first sidewalls of the conductive pillars, and the inclined portions are respectively disposed at second sidewalls of the conductive pillars, wherein a height of the first sidewalls is greater than a height of the second sidewalls;
• a second device comprising a plurality of conductive pads;
• and
• a plurality of solder regions respectively disposed between the conductive pillars and the conductive pads to bond the first device and the second device, wherein an amount of the solder regions on the first sidewalls of the conductive pillars is smaller than an amount of the solder regions on the second sidewalls of the conductive pillars.

A semiconductor package, comprising:

• a first device comprising a conductive pillar, wherein the conductive pillar has a first sidewall and a second sidewall, and a height of the first sidewall is greater than a height of the second sidewall;
• a second device;
• and
• a solder region between the conductive pillar and the second device, wherein the solder region includes a first portion and a second portion, the second portion is disposed between the first portion and the conductive pillar and the first portion is in direct contact with the second device, and the second portion is hanging over a sidewall of the first portion and is disposed on the second sidewall of conductive pillar.