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US 11,901,322 B2Granted
Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die
AssigneeMagnaChip Semiconductor, Ltd.
InventorsJin Won Jeong, Jae Sik Choi, Byeung Soo Song
Life of this patent
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Abstract
A semiconductor chip packaging method includes forming a bump on a wafer, forming a coating film covering the bump, laser grooving the wafer, plasma etching the wafer on which the laser grooving is performed, exposing the bump by removing the coating film covering the bump, fabricating a semiconductor die by performing mechanical sawing of the wafer, and packaging the semiconductor die.
Claims10
A semiconductor die, comprising:
- a semiconductor substrate comprising a semiconductor die region and a seal-ring region;
- an interlayer insulating film, a metal wiring, and a metal pad formed on the semiconductor substrate;
- a passivation insulating film formed on the metal pad;
- a metal bump connected to the metal pad;
- an anisotropic conductive film (ACF) comprising conductive balls and formed on the semiconductor die;
- and
- a flexible substrate attached to the ACF and curved toward the seal-ring region of the semiconductor die,
- wherein a thickness of the interlayer insulating film disposed in the seal-ring region is smaller than a thickness of the interlayer insulating film disposed in the semiconductor die region.
5 more elements
A semiconductor die, comprising:
- a semiconductor substrate comprising a semiconductor die region and a seal-ring region;
- an interlayer insulating film, a metal wiring, and a metal pad formed on the semiconductor substrate;
- a passivation insulating film formed on the metal pad;
- a metal bump connected to the metal pad;
- an anisotropic conductive film (ACF) comprising conductive balls and configured to be attached to the semiconductor die;
- and
- a flexible substrate attached to the ACF and curved toward the seal-ring region of the semiconductor die.
4 more elements
Dependencies are inferred from the claim text.