Electronic assembly

An electronic assembly comprising:

• a substrate comprising a first surface and a second surface opposite to the first surface, the substrate further comprising a plurality of substrate interconnects;
• a plurality of semiconductor dies mounted on the first surface of the substrate, wherein the plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects;
• a plurality of electrical connectors mounted on the second surface of the substrate, wherein each electrical connector is disposed opposite to a respective semiconductor die;
• a plurality of power supply modules corresponding to the plurality of semiconductor dies, wherein each power supply module is detachably connected to a respective electrical connector;
• and
• a plurality of stiffening members coupled to the substrate, wherein the plurality of stiffening members are configured to control warpage of the substrate, and wherein individual stiffening members comprise:
• a first stiffening portion disposed on the first surface of the substrate;
• and
• a second stiffening portion disposed on the second surface of the substrate.

An electronic assembly comprising:

• a substrate comprising a first surface and a second surface opposite to the first surface;
• a semiconductor die mounted on the first surface of the substrate;
• a power supply module mounted on the second surface of the substrate, wherein the power supply module is disposed opposite to the semiconductor die;
• and
• a plurality of stiffening members coupled to the substrate, wherein the plurality of stiffening members are configured to control warpage of the substrate, and wherein individual stiffening members comprise:
• a first stiffening portion disposed on the first surface of the substrate;
• and
• a second stiffening portion disposed on the second surface of the substrate.