Semiconductor device package assemblies with direct leadframe attachment

A semiconductor device package comprising:

• a substrate;
• a first semiconductor die having a first side and a second side opposite the first side, the first side of the first semiconductor die being disposed on and coupled with the substrate;
• a second semiconductor die having a first side and a second side opposite the first side, the first side of the second semiconductor die being disposed on and coupled with the substrate;
• a leadframe including:
• a first leadframe portion including a first planar body having a first indentation disposed therein, the first indentation defining a recess that is wholly disposed within an interior of the first planar body, a contact surface of the first indentation being disposed on and coupled with the second side of the first semiconductor die;
• and
• a second leadframe portion including a second planar body having a second indentation disposed therein, the second indentation defining a recess that is wholly disposed within an interior of the second planar body, a contact surface of the second indentation being disposed on and coupled with the second side of the second semiconductor die;
• and
• conductive adhesive that:
• couples the contact surface of the first indentation with the second side of the first semiconductor die;
• and
• couples the contact surface of the second indentation with the second side of the second semiconductor die,
• the contact surface of the first indentation includes a first contact surface and a second contact surface, the first indentation including:
• a first tab including the first contact surface, the first tab being coupled with the first semiconductor die;
• and
• a second tab having the second contact surface, the second tab being coupled with the first semiconductor die.

A method for producing a semiconductor device package, the method comprising:

• coupling a semiconductor die with a substrate such that a first side of the semiconductor die is coupled with the substrate;
• forming an indentation in a planar body of a leadframe, the indentation defining a recess in the planar body, the recess defining an opening in the planar body, the opening having a continuous perimeter,
• the indentation including:
• a first tab having a first contact surface coupled with a second side of the semiconductor die opposite the first side;
• and
• a second tab having a second contact surface coupled with the second side of the semiconductor die;
• and
• directly coupling at least a portion of the indentation with a second side of the semiconductor die via a solder material, the second side of the semiconductor die, the second side of the semiconductor die being opposite the first side of the semiconductor die.